Electronics Forum | Fri Dec 14 02:51:44 EST 2001 | genglish
This forum is becoming a salesmans dream! I agree with the first guy, check the archives as there is alot of information about cleaning and media. Our company uses a Kerry SC1000 machine very good process but mechanically we have had problems with t
Electronics Forum | Tue Sep 22 23:43:46 EDT 2009 | rohitfast
Hi Stephen, Can you pl suggest what exactly needed for the process? There is no any standard method to ensure for the ESD damage. ESDS:2020 is talking about only for persoanl and equipement grounding mechanism, in the process no insulator should be
Electronics Forum | Thu Nov 06 14:24:52 EST 2014 | wolverine
As part of the process of assembly, we have to scuff the surface of our board around the border about a half inch in from the edge before application of an adhesive. We have been doing this by hand with 60 grit sandpaper, we are looking for a way to
Electronics Forum | Tue Apr 13 19:47:05 EDT 2004 | davef
Glue has different mechanical, thermal, and electrical properties than solder. That's why all these very nice no-lead people are furiously trying to gin-up some wacky solder alloy, rather than using glue. Among the papers in the SMTA Knowledge base
Electronics Forum | Wed Oct 04 09:55:51 EDT 2006 | borgie
Hi. I have product in lead containing process that consist lead free BGAs and also big ceramic BGAs with high temperature bumbs. Pcb tends to bow in a reflow profile, since I need long preheating times and relatively high peak temperature to melt BG
Electronics Forum | Wed Aug 01 15:18:40 EDT 2018 | dleeper
One option might be to convert the coil to through hole and use intrusive reflow AKA pin in paste. the coil leads would have to be formed perpendicular to the board instead of parallel. you would have through holes instead of SMT pads, but you would
Electronics Forum | Wed Jul 24 07:18:12 EDT 2002 | lloyd
Hi, We occasionaly have problems with some of our panellised boards breaking away from each other. The section joining them is very small and makes the assembly weak. The boards are normally broken off during our through hole process (bad handling)
Electronics Forum | Thu Nov 05 03:40:34 EST 2009 | valeo
Hi Rajeshmara, Mail sent with the datasheet of the glue we use in production. Thanks for first information you provide me for the shear specifications on 1206. But can you be more precise on this point ? How did you define it ? Is anyone have more
Electronics Forum | Wed Mar 25 15:12:14 EDT 2015 | marcelorotofrance
Hi, Bob you're right. I replaced the Z-rod and the machine started to go alright. When I examined the head's mechanism I omitted to check the most exposed an delicate part... my bad. The old Z-rod came with the machine, and its slide movement was loc
Electronics Forum | Thu Sep 11 15:23:31 EDT 2003 | Peter L.
I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look a
.gif)
