Electronics Forum | Fri Nov 05 15:44:50 EST 1999 | Tim Jensen
Brian, 96.5Sn/3.5Ag is eutectic at 221 C 95Sn/5Ag has a melting range of 221 - 240 C Hope that helps you out...
Electronics Forum | Mon Dec 24 09:40:19 EST 2001 | davef
Your peak temperature needs to be 20 to 30�C GT the melting point of the solder. What is the melting point of: * Tamura 60-30 paste? * Tin lead on your connectors? [You imply that it is 63/37, but is that correct?]
Electronics Forum | Thu Mar 04 15:37:18 EST 2004 | adlsmt
Lead melts at 340C and vaporizes at 1740C (at least someone told me that) 63/37 tin/lead melts at 183C, so does anyone know at what temp the lead will vaporize in this alloy or is it the same 1740C?
Electronics Forum | Wed Dec 15 08:32:35 EST 2004 | ptavernier
Thank's Pete, I know is an old product but I would know its reflow thermal profile because I'm not sure about it. It's a linear melting or an melting with soak zone ? I haven't data on alphametals.com ...
Electronics Forum | Wed Oct 04 16:30:12 EDT 2006 | russ
I hope you are not trying to melt the Ceramic BGA columns. these are not meant to melt. I would run a lead process at peak temp of 225 -230C with lead paste. The board warpage may be of design issue or Manufacture issue. Russ
Electronics Forum | Wed Feb 07 18:30:11 EST 2007 | greg york
or low melt Sn/Pb/Bi alloy, readily available and fairly cheap.If your UK based I will send you a sample if it will help you prove it cheers greg
Electronics Forum | Thu Feb 22 05:30:06 EST 2007 | lococost
nothing but... We've had peel-off melting after reflow, burn up and turn hard and brown, melt in the holes and then turn hard... All very hard to remove afterwards. We have yet to find a proper solution.
Electronics Forum | Tue Jun 05 10:07:26 EDT 2007 | stepheniii
I think the point the others are missing is that the solder gives off the exact amount of heat required to melt it when it goes solid. That is the heat it gives off when going solid equals the heat it takes to melt it. And while the solidifying solde
Electronics Forum | Thu Dec 24 04:23:49 EST 2009 | leeg
Has anyone had any experience of using High Melting Point Solder paste in production. We have started to trial some boards using the Solder Paste and are experiencing poor solder joints and solder joints that look grainy.
Electronics Forum | Tue Mar 16 16:59:09 EDT 2010 | davef
Most often 'solder graping' refers to poor solder wetting, where the solder paste has partially melted, but has not coalesced or flowed. Sometimes this leaves the outline of the partially melted solder balls still visible, giving the appearance, to
