Electronics Forum | Tue Jul 01 17:15:03 EDT 2008 | ronhodgson
I would like an interpretation of a solder fillet on a 5 side termination cap. (Ref: IPC-610, sec. 8.2.2.6). My question pertains to the definition of dimension F, and what constitutes the top of the fillet. Does the top of the fillet end at where
Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve
Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men
Electronics Forum | Tue Jun 28 07:27:32 EDT 2005 | Matt Kehoe
We are experiencing a situation that we would really appreciate some expert opinions on. Our process prints solder paste then reflows it without components. Normally the paste wicks into a very shiny rounded meniscus. Even over gold, the round pads a
Electronics Forum | Mon Jul 17 17:37:10 EDT 2006 | russ
Okay, now we can get rolling here. Here is a couple of things about selective wave that Ihave found very helpful 1. Make sure that no parts on back side are in excess of .15". if they are we skip; out in SMT and handsolder if labor costs justify.
Electronics Forum | Sat Dec 04 10:21:39 EST 2010 | doremi
Hi, I work with Omron AOI for almost 5 years. Sorry for the late reply, but I visit this site very seldom Basically Omron are considered as the best in solder joint inspection because it used patented 3 colour highlight principle and in 99% the missi
Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian
| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |
Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F
| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc
Electronics Forum | Tue Sep 24 11:10:07 EDT 2002 | Gregg Temkin
I�d appreciate assistance in trying to resolve a placement/soldering problem. My company has designed a board which uses a large number of 0402 LED�s that are .028� high. The LED�s need to be soldered so that they point straight up and are not til
Electronics Forum | Sat Oct 09 09:07:48 EDT 1999 | Brian
| | | Can anyone tell me the formula/method to determine | | | the amount of weight that solder's surface tension can support. | | | (ie: Maximum weight of components soldered onto a bottom side | | | of a board during a top side reflow on a Paste/Pa
Electronics Forum | Sat Oct 09 09:18:21 EDT 1999 | Dave F
| | | | Can anyone tell me the formula/method to determine | | | | the amount of weight that solder's surface tension can support. | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | of a board during a top side reflow on a
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