Technical Library | 2014-05-22 17:10:37.0
In this paper, the general solution model of Chou has been used to predict the integral enthalpies of mixing of liquid In-Sn-Zn ternary alloys in five selected sections, xIn/xSn = 0.15/0.85, 0.34/0.66, 0.50/0.50, 0.67/0.33 and 0.85/0.15. The other traditional models such as Kohler, Muggianu, Toop and Hillert are also included in calculations. Comparison with literature data was done and showed reasonable agreement with Toop and Hillert asymmetric models.
Technical Library | 2022-10-31 08:25:43.0
Material: Iron Model Name: NSC CHUCK Top Quality: 180g Automatic / Manual: Automatic Specification: Original New，copy New Shipping Method: FedEx, DHL, Etc.
Technical Library | 2021-09-15 18:58:01.0
Mathematical model for dynamic force analysis of printed circuit boards has been designed to calculate dynamic deformations and stresses in printed circuit boards and assess their dynamic strength and rigidity. The represented model describes a printed circuit board as a separate oscillatory system, which is simulated as prismatic beam set on two oscillating supports. Simulation and assessment of stress and deflection in printed circuit boards and obtaining their amplitude frequency responses provided recommendations, which ensure strength and stiffness of printed circuit boards subjected to dynamic loads..
Technical Library | 1999-05-07 08:04:23.0
Stereolithography is a handy tool not only for speeding a design to market but also in giving customers an early edge. By allowing a form-and-fit sample to be quickly made from a computer model, stereolithography coupled with simultaneous engineering allows customers to see product models early in the design cycle. And if a picture is worth a thousand words, what's a tangible sample worth?
Technical Library | 1999-05-07 08:48:52.0
This paper describes how the quality and reliability of Intel's products are designed, measured, modeled, and maintained. Four main reliability topics: ESD protection, electromigration, gate oxide wearout, and the modeling and management of mechanical stresses are discussed. Based on an analysis of the reliability implications of device scaling, we show how these four topics are of prime importance to component reliability...
Technical Library | 2019-04-24 20:06:51.0
Choosing an outsourced manufacturing partner that is perfect for a new product and close to your design team is quite different to choosing a partner that can manufacture that same product in volume in lower cost locations and fulfill globally. This is where the Gateway model comes into its own. Most large EMS have structured their organizations to leverage proximity to OEM design teams in high cost regions while providing the benefits of low cost regions for volume manufacturing. The "Gateway" facility in higher cost regions provides design engineering, supply chain design, prototype, and NPI services. The goal of the Gateway is to develop an effective build recipe that can then be effectively and seamlessly transferred to one or more volume manufacturing facility that offers lower costs and direct fulfillment to consumers.We will present a case study that highlights the value of this model and that shows some of the key elements that allow for seamless transitions from plant to plant. The Gateway model is an essential element to a successful global manufacturing model and helps ensure that products are made in the right geography.
Technical Library | 2014-04-03 18:01:13.0
A system level modeling methodology is presented and validated on a simple case. It allows precise simulations of electrostatic discharge (ESD) stress propagation on a printed circuit board (PCB). The proposed model includes the integrated circuit (IC) ESD protection network, IC package, PCB lines, passives components, and externals elements. The impact of an external component on the ESD propagation paths into an IC is demonstrated. Resulting current and voltage waveforms are analyzed to highlight the interactions between all the elements of an operating PCB. A precise measurement technique was designed and used to compare with the simulation results. The model proposed in this paper is able to predict, with good accuracy, the propagation of currents and voltages into the whole system during ESD stress. It might be used to understand why failures occur and how to fix them with the most suitable solution.
Technical Library | 2019-12-26 19:13:52.0
Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration.In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.
Technical Library | 2023-06-14 01:09:26.0
In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are often highly sensitive to the Anand parameters. In this work, an investigation on the Anand constitutive model and its application to SAC solders of various Ag contents (i.e. SACN05, with N = 1, 2, 3, 4) has been performed. For each alloy, both water quenched (WQ) and reflowed (RF) solidification profiles were utilized to establish two unique specimen microstructures, and the same reflow profile was used for all four of the SAC alloys so that the results could be compared and the effects of Ag content could be studied systematically.
Technical Library | 2016-06-23 13:24:56.0
Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly, a detailed manual process is often utilized. However, an automated fixture is used whenever applicable.This paper will illustrate the use of strain gauge testing and Finite Element Analysis (FEA) as a simulation tool to evaluate and optimize the heat sink assembly process by manual and automated methods. Several PCBAs in the production line were subjected to the manual and automated assembly process. Strain gauge testing was performed and FEA models were built and run. Results were compared with the goal of improving the FEA model. The updated FEA model will be used in simulating different conditions in assembly. Proposed improvement solutions to some issues can also be verified through FEA.
