Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Mon Jul 12 04:19:19 EDT 2010 | jepoy18
Hi All, Good day, Is there a Paper type packaging for LED 1608. Our available feeder in our production is for paper type but we are using emboss type reel packaging... thanks and regards.. Jeff
Electronics Forum | Mon Jun 21 15:00:41 EDT 1999 | jgodfrey
I am finding that some of our IC's are coming from the supplier with the humidity gauge in the bag reading 10-20%. Has anybody done any tests to determine what humidty level in a package will cause problems during reflow?
Electronics Forum | Mon Sep 01 02:24:10 EDT 2008 | omid_juve
we use another device with the same package but it doesn`t have any solderability problem . the things that we are hesitate on is the difference between the pin alloy in these two different packages . also i should say that in rework station it will
Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef
Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad
Electronics Forum | Sun Aug 31 07:13:13 EDT 2008 | allan99
All that they are telling is important (variants in the process), what you can do in a fast way is: change the component for a new one (date of manufacture / other supply - if you have); change the component (test - same package but other specificati
Electronics Forum | Mon Feb 04 20:27:25 EST 2002 | davef
1,000 G ohm ||100 M ohm Dielectric Constant ||9.5 ||4.9 Loss Factor ||5 - 20 ||200 * E indicates exponent Continuing: * Spacing between same plane traces effect the electical parameters between the traces. * Dielectric materials used between diff
Electronics Forum | Wed Apr 16 13:19:13 EDT 2003 | Takfire
Thanks Russ! The origianal complaint from the customer was in regards to what appeared as "bumpy" appearance and "holes" in the solder fillet. This problem was originally presented as an appearance issue only. Further investigation by our DPA lab r
Electronics Forum | Mon Mar 26 22:57:28 EDT 2007 | sleech
Paul: You are dead-on! Desiccant and nitrogen cabinets are a great way to maintain the current moisture content level of a MSD package. But if you look at the 40 degree C schedule (Table 4-1) in J-Std-003B, you will find that the drying capability o
Electronics Forum | Tue Aug 26 22:56:39 EDT 2008 | omid_juve
we have solderability problem(some pins aren`t soldered) with two devices in our board with the below detail EP1K30QI208-2 brand:ALTERA with the package PQFP-208 TMS320VC5416PGE160 brand:TI with the package TQFP144 these two devices are pb free but t
