Electronics Forum | Wed Jan 09 09:31:53 EST 2008 | flipit
I solder LEDs everyday from 0402 sizes on up. I work for an optical company so every product I make has LEDs. Some products have hundreds of LEDs per circuit. The problem is that clear materials are not filled materials and thus don't have the adv
Electronics Forum | Mon Aug 25 08:26:33 EDT 2008 | scottp
We've gone through this a couple times. Once it was because the device was warping in reflow. We confirmed with shadow moire that the corners were lifting up. The supplier fixed some things in their molding process to reduce the warpage. Another
Electronics Forum | Wed Jun 03 07:13:27 EDT 1998 | Tom Tellinghuisen
| We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not al
Electronics Forum | Tue Nov 06 10:06:33 EST 2018 | davef
Electronic Connector Industry News Resources + Surface Finishing + Metal Finishing + Products Finishing + Interconnection World (Connector Specifier) Electronic Connector Associations + IEEE USA + International Electronics Manufacturing Initiative (
Electronics Forum | Sun May 17 13:46:30 EDT 1998 | Steve Gregory
Hi All! I've been reading this conversation which prompted me to break out the IPC-SM-786A from the IPC manuals from our parent company in Maryland sent us (we're just starting up in California). It's the Procedures for Characterizing and Handling of
Electronics Forum | Thu Apr 27 21:20:38 EDT 2000 | Dean
Here are some pointers to use during your X-ray inspection. Microcracking is virtually impossible to determine with X-ray. However, I suspect you are looking for "hard" opens. Those are much easier to find visually. If using a paste-and-place pro
Electronics Forum | Wed Aug 16 18:03:10 EDT 2000 | John Thorup
Hello CK Do I understand you correctly that you are reflow soldering a copper case containing a previously assembled PCA? Insulation would seem to pose a few problems that would need to be passed on by the design engineer. 1. Keeping the heat of refl
Electronics Forum | Thu May 25 11:31:52 EDT 2006 | muse95
Patrick, I believe you are mistaken about this being a myth. Many component manufacturers changed more than plating to make their component withstand higher temps. Some changed mold compounds, others changed plastic types used. Many of these change
Electronics Forum | Thu Dec 07 13:51:59 EST 2006 | ganoi
I need advices as to how a gap between the bottom of an LED (1209-package) and the PCB can be controlled on a small rigid-flex PCBA? The problem that we experience is due to tight tolerance in the design of our molded housing in which this PCBA is as
Electronics Forum | Wed Jun 03 15:22:12 EDT 1998 | Greg Curler
| | We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not
