Electronics Forum | Tue Dec 24 20:04:04 EST 2019 | kylehunter
Hmm OK. Even a NASA article describes that rosin is safe not being cleaned lol.
Electronics Forum | Sat Dec 10 08:13:53 EST 2005 | davef
We believe imm tin suppliers say that their product does not whiskey, oops whisker, because they use 'white tin' not the 'gray tin' that causes whiskers. But as soon as you alloy their tin with SAC or any other high tin content solder, all bets are
Electronics Forum | Thu Feb 10 11:29:19 EST 2011 | patrickbruneel
If you search the documents for tin whiskers it’s getting very interesting. Also you can find in the report that lead-free (SAC) solder is used. http://www.nhtsa.gov/staticfiles/nvs/pdf/NASA-UA_report.pdf This report also confirms that the board
Electronics Forum | Tue Oct 11 14:42:15 EDT 2005 | patrickbruneel
NASA website on Tin whiskers: http://nepp.nasa.gov/whisker/ NEMI Tin whisker activities: http://www.inemi.org/cms/projects/ese/tin_whisker_activities.html CALCE Tin Whisker Working Group: http://www.calce.umd.edu/lead-free/tin-whiskers/ Measur
Electronics Forum | Wed Nov 21 10:15:53 EST 2007 | davef
On one hand, maybe National Aeronautics and Space Administration standards are a good starting point to establish standards for ruggedized manufacturing practice. Look here: http://workmanship.nasa.gov/wkstds_nasa.jsp On the other hand, as you say
Electronics Forum | Thu Mar 12 21:14:16 EDT 2009 | davef
Mask: * I/O connector contact surfaces * Bus connector contact surfaces * Configuration jumper blocks * Test points * Surfaces that contact heat sinks (heat sinks are removed prior to coating) * Board mounting holes * Adjustable potentiometers * P
Electronics Forum | Tue Jun 13 22:42:36 EDT 2000 | Dave F
Jeff: Last place I can recall seeing something like that is NASA-STD-8739.3 Requirements like this are not currently in vogue. A modern solder process should conform to J-STD-001, which makes no mention of prebaking boards.
Electronics Forum | Tue Jul 23 14:17:46 EDT 2002 | davef
Hell-loooow!!! Why not contact the document author? Try: Reza Ghaffarian - Reza.Ghaffarian@jpl.nasa.gov Jet Propulsion Laboratory Phone: 818 354-2059 | FAX: 818 393-5245
Electronics Forum | Wed Sep 17 15:44:28 EDT 2003 | davef
Look here: http://nepp.nasa.gov/DocUploads/CE5125B5-E0EB-4CFA-8867BE3F3E342CA5/moisture%20effect%20Ta%202C%20M.pdf
Electronics Forum | Fri May 14 14:35:51 EDT 2004 | davef
Try: * NASA-STD-8739.1 Workmanship Standards For Staking And Conformal Coating Of Printed Wiring Boards And Electronic Assemblies * NHB 5300.4(3J) Requirements for Conformal Coating and Staking of Printed Wiring Boards and Electronic Assemblies
