Industry News | 2019-10-18 10:46:46.0
Seika Machinery, Inc. today announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. Seika will highlight leading-edge equipment, including the latest models from SAWA, Unitech and MALCOM in Booth #620.
Industry News | 2022-10-28 05:51:41.0
Seika Machinery, Inc. is pleased to announce its year-end sale on select products. Significant savings are available for McDry cabinets, Sawa ultrasonic stencil cleaners, Sayaka PCB routers and Malcom process control equipment while stock lasts.
Industry News | 2022-12-14 12:15:44.0
Seika Machinery, Inc. announced its product line up for the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. Seika plans to demonstrate the new SAYAKA PCB Router SAM-CT34XJ Stand Alone & In-Line Solution, Kyowa MRS-100 Strain Gauge Monitor, Sawa Ecobrid, McDry DXU-1001A with Data Logger, Malcom RCX Modular profiling system and more in Booth #2732.
Industry News | 2023-04-11 10:04:21.0
BTU International, Inc. will exhibit in Hall 4A, Stand 210 at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. At the show, BTU will show its brand new Profile Tracer, a next-generation thermal profiling tool providing real-time data acquisition for oven optimization by identifying inconsistencies due to temperature variables at both the product level and at the heat source.
Industry News | 2024-03-18 13:30:16.0
Solderstar is set to showcase its latest innovation at the EPP InnovationsFORUM 2024 in Leinfelden-Echterdingen, Germany on 17th April. Taking centre stage will be the Reflow Shuttle O2 an advanced process verification tool designed to enhance quality control in electronics manufacturing.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2023-11-06 12:42:11.0
Altus Group has announced a significant enhancement to its product offerings with the introduction of Solderstar's cutting-edge technology, the Reflow Shuttle O2 measurement module.
Industry News | 2014-05-13 18:08:42.0
ASC International will exhibit at the Toronto SMTA Expo & Tech Forum, scheduled to take place Thursday, May 15, 2014 at the Four Points by Sheraton Toronto Airport in Toronto, ON.
Industry News | 2021-06-09 04:41:58.0
Seika Machinery, Inc. has seen increased popularity and demand of its process control systems.
Industry News | 2018-01-24 20:59:22.0
Seika Machinery today announced plans to exhibit in Booth #2043 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. Seika will showcase a complete lineup of leading-edge equipment, including the latest models from McDry, Sawa, Sayaka, HIOKI and MALCOM.
