Industry News | 2003-02-26 09:07:20.0
Investments by electronics manufacturing companies of millions of dollars in software products to manage and automate supply and demand quantification have not prevented margins of error from 50% to 100%
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2013-11-13 12:39:14.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2013 Global Technology Award in the category of LED Production Equipment for its MV-9XP LED Package Inspection System.
Industry News | 2010-08-27 23:30:57.0
OXFORD, CT – MIRTEC, the "Market Leader in Inspection Technology," has released PowerPoint presentations for each product series featured on its Web site.
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-04-09 08:25:50.0
A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.
Industry News | 2003-04-29 08:27:33.0
Emerson Energy Systems is using Weidmuller's Minimate S2L/B2L PCB connector for its IMT 2000 multifunction unit, thanks to its space saving design and competitive price.
Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2009-04-08 20:48:52.0
OXFORD, CT � April 2009 � MIRTEC announces that it has been awarded a NPI Award in the category of Test & Inspection-AOI for its MV-3L Desktop AOI System. The award was presented to the company during a Monday, March 30, 2009 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2009.
Industry News | 2009-11-11 12:29:12.0
OXFORD, CT — November 2009 — MIRTEC announces that it has been awarded a second consecutive Global Technology Award in the category of Inspection-AOI Systems.
