Electronics Forum | Mon Dec 12 14:04:33 EST 2005 | craigj
Hi All was wondering is there anything I should be aware of or look out for if using parts with SnBi (Pb free) lead plating with Sn/Pb/Ag solder paste? I was always lead to believe that mixng lead and bismuth caused problems or are the bismuth levels
Electronics Forum | Mon Jan 12 04:28:05 EST 2009 | sachu_70
What is your alloy composition? Although your solder paste may have lower melting point, what about the alloy / metal used for plating solder lands on PCB and component termination? In most cases, there is no reliable joint as such solder may not com
Electronics Forum | Thu Jan 15 10:33:05 EST 2009 | rrpowers
One thing you must be very careful with when using Bismuth is that there is no lead anywhere else within the process, either components or boards. Lead-terminated components or hot air solder leveled (HASL) finished boards used in combination with a
Electronics Forum | Sat Nov 06 14:58:45 EST 1999 | Gary Moravchik
Assuming you are using Sn63/Pb37 solder paste, have you tried using a lower temp melting point solder paste for the second pass? For example, use 63/37 for first pass and a Bi58 compound solder paste for the second pass. If I recall, Bi58's melting
Electronics Forum | Tue Jan 13 04:35:26 EST 2004 | pablowe
We have done some trials with Lead free which appear to have gone well. We will be introducing a number of new products over the coming months and it is an opportune time to begin using lead free on these products which will be required by law in the
Electronics Forum | Thu Sep 01 12:55:39 EDT 2005 | bhu
I assume you mean Dr. Jenny Hwang--I attended her lead free seminar and found that most of her info is a good place to start. One of the debates about her work is whether bismuth should be used in any formulation. Many of the paste manufacturers di
Electronics Forum | Tue Jun 18 04:01:07 EDT 2019 | aite
Hi! You can choose low-temperature solder paste. The low-temperature solder paste is tin and antimony with a melting point of 138 °C. When the components of the patch cannot withstand the temperature of 200 ° C and above and the patch reflow process
Electronics Forum | Fri Sep 07 10:46:23 EDT 2001 | davef
Comments are: * Sn42Bi58 is eutectic at 138�C. Most top-flight paste suppliers will produce it for you. * Bismuth forms an alloy with lead with a melting point of 93�C * Maximum temperature of the solder connection should be less than 100�C during
Electronics Forum | Fri Jun 21 03:05:41 EDT 2019 | gregoryyork
The only problem with non silver tin bismuth is its very prone to shock damage and components fall off,literally. Would only recommend it with Silver additions and around 1%.
Electronics Forum | Thu Sep 05 11:05:35 EDT 2019 | SMTA-Tony
There are competitors to REL solder alloys from AIM. Tin-Copper-Nickel-Bismuth alloys (Nihon Superior) are an alternative option which do very well in thermal cycle testing. The reflow profiles required are similar to SAC305 profiles. You may als
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