Electronics Forum | Thu Dec 04 07:12:00 EST 2003 | ex maintain leader
Hi Mark, I'm ex Fuji smt service engineer, now I'm leading a a team wich repairs pc-boards in Europe. During replacing P4 processor socket I use an old srt-bga rework staion and an mimistencil wich can be placed abowe the bga pads. My 5 Y experience
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire
Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a
Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire
Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a
Electronics Forum | Fri Nov 03 11:08:29 EST 2000 | Phil
Hi there!!! Actually, all mentioned ideas were significantly related to the cause of tombstoning. But, based on what DL said, you have to check the placement of your 0402. Coz, based on experience, i evaluated the different variables for the root
Electronics Forum | Wed Jan 06 21:56:37 EST 1999 | Steve Gregory
| Youse: This is SMTnet Steve. Sacrifice the socket. By the time you finish putzing-around removing the balls to get the socket off the board, replacing the lifted pads on the board, and reballing the socket; you've burnt the $100 that the socket
Electronics Forum | Wed Jan 06 23:01:48 EST 1999 | Dave F
| | Youse: This is SMTnet Steve. Sacrifice the socket. By the time you finish putzing-around removing the balls to get the socket off the board, replacing the lifted pads on the board, and reballing the socket; you've burnt the $100 that the socke
Electronics Forum | Thu Aug 24 12:53:56 EDT 2006 | russ
yes, it could have been from all 3 locations. without any detail whatsoever about your process or anythign it is impossible to help!! please check your incoming material prior to processing please check your reflow profile to ensure that max temp
Electronics Forum | Mon Jul 16 21:39:40 EDT 2001 | davef
The method you suggest is about the only way to �clean-up� this terrible situation. Realistically, this is a "memory" type condition induced by design, build symmetry, "cross ply construction", excessive cool down rates during lamination or reflow a
Electronics Forum | Thu Jan 07 16:46:05 EST 1999 | Steve Gregory
Hey ya'll!! SUCCESS! I was able to get that monster off!...(Now I just gotta' be able to get it back on right...hehehe) If you remember, the whole reason I had to rework it was because somehow they got the hole positions wrong in the board for
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