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For the technology by hand, finger tape for handling and assembling before soldering,cleaning of components and pc boards by Plasma. Tools – vacuum Tools - vacuum tweezers without external pump,cups
New Equipment | Cleaning Equipment
World’s First Cleaner & ROSE Tester Removes Fluxes Performs IPC ROSE Test Closed Loop Operation - No Drains Aqueous or Organic Solvents Stainless Steel Construction Automatic Wash/Rinse/Test/Dry 230VAC, 10AMP, 50/60Hz
Industry News | 2020-03-22 11:52:51.0
Flux manufacturers have already reported a remarkable shortage of stocks for alcohol-based fluxes used in electronics manufacturing. Interrupted supply chains and an increasing demand for alcohol as a basis for disinfectants has resulted in massive price increases.
Industry News | 2012-11-11 14:07:47.0
Plasmatreat North America (PTNA) offices have moved to new premises, which are located in Ancaster, Ontario (CAN), about 45 miles west of Toronto/ Pearson International Airport and about 90 miles from Buffalo/Niagara Airport (USA).
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman
I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process
Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas
We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob
Electronics Forum | Wed Jan 09 18:17:15 EST 2002 | Chris
I don't have a plasma cleaner either. It will help a lot. Actually I don't clean at all. Our wirebond pads are far enough away so the flux residue does not get on the wirebond pads. That's what we think anyway. I am sure we have some degree of c
Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Mon Oct 26 07:37:15 EDT 2009 | mysmt
Hi, Is your problem solved? If yes then how? Have you tried Plazma cleaning before wire bonding? BR
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