Electronics Forum | Thu Dec 12 13:37:33 EST 2002 | gregoryyork
Have you considered the plating of the component could be Pb free as this generally wont be liquidus until 232C typically. seeing more and more of these unmarked components coming through so worth checking latest batch of problems on unmarked QFP's a
Electronics Forum | Sat Nov 23 06:28:23 EST 2002 | Alistair Johnston
I work for A PCB manufacturer and have a request to plate a board with Gold to BS4292. We dont hold this spec and wonder if anyone can explain what is entailed in this spec.
Electronics Forum | Tue Dec 10 16:30:44 EST 2002 | Randy Villeneuve
Tin is pretty standard. I would doubt your leads are only Nickel plated as Nickel will oxidize very quickly.
Electronics Forum | Tue Dec 10 23:10:20 EST 2002 | praveen
Please correct me if wrong. It means I have to increase the temp. further ?
Electronics Forum | Tue Dec 10 19:30:49 EST 2002 | Vijay
Hi Dave, The peak temp on the leads is 216-218 Deg C and duration above MP (179 degC) is 55-60 sec. Alloy(solder paste) used 62 Sn,36 Pb 2Ag (Alpha WS 609 Ty 3 Water eash) This is a SMT connector wth Gulwing leads Gold plating on the PCB is 2-5 micr
Electronics Forum | Tue Jan 10 12:17:17 EST 2006 | Rob
Hi, The ROHS compliant parts are usually Matte Tin on the outer terminal plating. There are also 2 further types of metal on the average chip cap - the undercoat metal of the outer electrode & the inner electrode. These are usually the same & are
Electronics Forum | Tue Dec 10 22:18:32 EST 2002 | davef
Randy's correct. If you were soldering to nickel with WS609, you would be complaining about non-wetting, not lumpy solder flow.
Electronics Forum | Wed Dec 11 09:41:26 EST 2002 | davef
I'd guess that you need to sit at your current 216-218*C peak for that 5 to 10 seconds that I mentioned earlier. Increasing your peak is the easiest way to do that, as you say.
Electronics Forum | Thu Feb 04 03:18:31 EST 1999 | Teemu M�kiniemi
There is also the process where thicker levels or solder is being applied directly to the board. This means no solder paste is applied before component placement. Just flux, place, and refow. Chris G. Can you tell me more about the process, or
Electronics Forum | Sat Nov 23 08:10:43 EST 2002 | jax
BS4292: Electroplated Coatings of Gold and Gold Alloys Gold and gold alloys for engineering purposes Single, double or multilayer electrodeposited coatings on metallic and non-metallic materials for electrical, electronic and other engineering appl
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