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Industry News | 2009-04-13 16:26:48.0
MADISON, AL � April 2009 � STI Electronics Inc., a full service organization providing training, electronic and industrial product distribution, assembly and solder training kits, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces its Engineering, Distribution and Training Services will be featured at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2009-09-18 09:45:17.0
MADISON, AL — September 2009 — STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that it will feature its full range of services in booth 300 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2009-04-13 16:21:36.0
MADISON, AL � April 2009 � STI Electronics Inc., a full service organization providing training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that the company's Industrial and Electronics Distribution division will feature numerous products, along with STI's Engineering and Training Services at the upcoming Huntsville Expo and Tech Forum, scheduled to take place Tuesday, April 14, 2009 at the Von Braun Center in Huntsville, Ala.
Electronics Forum | Mon Apr 04 09:35:16 EDT 2005 | russ
What are the max temp specs for each of the components? this sounds like the real problem with lead free conversion. Which parts are which? Currently we are getting ready to reball lead free BGAs back to lead for a customer that had to be lead free
Electronics Forum | Mon Mar 27 10:44:12 EST 2000 | Brian E. Steelglove
Josue, I know KME or Create makes a BP10 for BGA reballing and a BP20 for CSP. The only problem is that these machines are only used overseas so far. Brian Steelglove
Electronics Forum | Thu Jun 09 13:38:16 EDT 2011 | rdubya
You might want to check the components as well, I've seen a similar problem with re-balled parts using the wrong diameter ball. that would also contribute to added solder. good luck
Electronics Forum | Wed Apr 14 14:28:32 EDT 2021 | lpbro
My first move is inspect the blades, swap the blades around and re-balance the blades to see if it is a problem that corresponds with a specific blade. Also try a different pair of blades. Full restart on the printer incase of an odd software problem
Electronics Forum | Wed Mar 01 02:10:05 EST 2017 | soldertraining
Hi! I am Bob and pls forgive me if technical words I use are wrong. What may cause the BGA solder pad lift before or after reball? I am having problems where solder pad lifted during removal of bad solder ball. It also occurred during reball, where t
Electronics Forum | Fri Mar 23 15:33:53 EDT 2007 | ppcbs
Does anyone know where to purchase 90/10 & Lead Free solder balls and kits for BGA Reballing? I'm having service problems with my current vendor who decided that they no longer wish to sell 90/10 balls, can't take in an order without a quote, and ca
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