Industry News: rf applications (Page 2 of 32)

International Wafer-Level Packaging Conference (IWLPC) Offers In-Depth Tutorials

Industry News | 2011-08-15 12:43:52.0

The SMTA and Chip Scale Review magazine are pleased to announce eight in-depth tutorials will be offered at IWLPC 2011. Tutorials are application-oriented and structured to combine field experience with scientific research to solve everyday problems.

Surface Mount Technology Association (SMTA)

SMTA Announces 7th International Wafer-Level Packaging Conference (IWLPC) Program

Industry News | 2010-06-28 16:44:36.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Registration is now available on-line. Early Bird conference pricing is in effect until September 10, 2010, after which registration prices will go up $100.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2011-07-20 14:49:09.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 8th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 3-6, 2011 at the Santa Clara Marriott Hotel in Santa Clara, California

Surface Mount Technology Association (SMTA)

SMTA Announces International Wafer-Level Packaging Conference (IWLPC) Call for Papers

Industry News | 2010-02-01 13:36:36.0

Minneapolis, MN - The SMTA, in conjunction with Chip Scale Review magazine, is pleased to release the Call for Papers for the 7th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC) to be held October 11-14, 2010 at the Marriott Santa Clara Hotel in Santa Clara, CA. The IWLPC Technical Chair, Lee Smith of Amkor Technology, and the IWLPC Technical Committee would like to invite you to submit an abstract for this program on or before April 23, 2010.

Surface Mount Technology Association (SMTA)

Dr. Bradley McCredie to Present Keynote at 2010 International Wafer-Level Packaging Conference

Industry News | 2010-06-21 14:15:46.0

Minneapolis, MN - The SMTA and Chip Scale Review magazine proudly announce that Bradley McCredie, Ph.D., IBM Fellow and Vice President of IBM Systems and Technology Group, will be the keynote speaker at the 7th Annual International Wafer-Level Packaging Conference being held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Dr. McCredie will present "Technology Scaling, Packaging, and Other Things That Might Put Our Kids Through College".

Surface Mount Technology Association (SMTA)

2003 Designers Learning Symposiums Take Shape

Industry News | 2003-09-11 16:50:12.0

The printed circuit board industry is an ever-changing marketplace. The technologies of today certainly aren�t standing still, and neither should today�s PCB designer

Association Connecting Electronics Industries (IPC)

International Wafer-Level Packaging Conference (IWLPC) Keynote Announced

Industry News | 2012-01-10 19:07:22.0

SMTA and Chip Scale Review magazine are pleased to announce the keynote presentation for IWLPC 2012 in San Jose, CA. John Ellis will detail the very possible threat of Cyber-Physical Terrorism in his presentation, "A Trojan Chip in Your Smartphone? It's Coming..."

Surface Mount Technology Association (SMTA)

IPC Issues Call for Participation for High Reliability Forum

Industry News | 2023-04-17 08:38:56.0

IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments. The High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport in Linthicum (Baltimore), Md.

Association Connecting Electronics Industries (IPC)

SMTA International Call for Papers - Deadline Approaches

Industry News | 2003-02-18 09:39:06.0

Encourages You to Submit an Abstract for this Year's Conference

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2012-08-02 11:47:58.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)


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