New Equipment | Assembly Services
US Based PCB Assembly Contract Manufacturer Since 1987, AGILITY mfg has specialized in the assembly of printed circuit boards and the manufacture of electro-mechanical assemblies for electronic design facilities, engineering firms, and OEM's. We
We are subsidairy of Malaysia Public Listed company with capabilities in BGA, SMT, 0402 chip, AI, ICT, MI & F/A from contract manufacturing to turnkey or consigment as customer requirement. We are ISO9001 2000 certified with RoHS conformance and LMW
New Equipment | Assembly Services
Lead and RoHS (Lead-Free) contract manufacturing of rigid or flexible circuit board assembly and testing. Full turnkey and consignment manufacturing services capabilities include; EMS for Rigid, Felxible and Rigid Flex Assemblies Mechanical Assem
9 SMT Assembly Lines Total placement capability 150,000 components/hr Fine pitch placement up to 12mil Component Ranges: 0201 to BGA and uBGA up to 55mm square 40 microns placement accuracy with 4 sigma capability RoHS Compliant Lines with N2 envi
New Equipment | Solder Materials
V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
Transition to Lead free will impact almost everyone in the electronics industry whether you consider yourself RoHS exempt or not. This is not a theoretical course. The objective of this course is to show you how you can resolve the business and techn
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
New Equipment | Assembly Services
Our extensive PCB assembly expertise incorporates: Prototypes and pilot builds Conventional electronics assembly Surface mount assembly State-of-the-art equipment RoHS and non-RoHS facilities Cost effective design Core to the JJS Electronics m
New Equipment | Assembly Services
CAMtek specializes in printed circuit board assembly offering state-of-the-art manufacturing. We offer a wide variety of services for their customers. We are your team for expertise in the following areas: Design for Manufacturability (DFME) Exc
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