Full Site - : secondary cure dymax (Page 2 of 8)

Altus Develop a Custom Conveyor Curing Solution with YJ LInk

Industry News | 2017-03-10 16:32:28.0

As YJ Link’s installed base continues to grow, Altus Group has repeatedly come across customers who were unhappy with curing systems on the market today. Considering this, Altus has worked with YJ Link and the curing lamp suppliers (UV & LED) to develop ‘custom’ solutions to overcome the shortcomings of the existing systems.

Altus Group

Engineered Material Systems Introduces 535-10M-49 UV Cure Adhesive

Industry News | 2014-03-31 16:21:29.0

Engineered Material Systems debuts its 535-10M-49 UV cured epoxy adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.

Engineered Materials Systems, Inc.

Specialty Coating Systems Introduces IR Thermal Preheating & Curing Systems

Industry News | 2022-07-31 19:25:25.0

Specialty Coating Systems (SCS) is pleased to introduce its new PrecisionHeat infrared radiation (IR) thermal preheating system and PrecisionCure TC IR thermal curing system. Both the PrecisionHeat and PrecisionCure can operate as stand-alone systems or fully integrate with the SCS PrecisionCoat selective conformal coating and dispensing system. The systems feature Windows®-based software with a touchscreen monitor and are designed for continuous operation, requiring minimal downtime for maintenance.

Specialty Coating Systems

Engineered Material Systems Introduces 535-10M-45 UV Adhesive for Microelectronic Assembly Applications

Industry News | 2014-01-09 10:39:28.0

Engineered Material Systems is pleased to debut its 535-10M-45 UV Cured Epoxy Adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.

Engineered Materials Systems, Inc.

Henkel Introduces Two Encapsulants Ideal for Sensitive Components

Industry News | 2013-03-13 13:43:59.0

Formulated to address the limitations of alternative products, Henkel Electronic Materials announces the commercial availability of two encapsulants for selective protection of environmentally-susceptible components. The materials, LOCTITE ECCOBOND UV9060F and LOCTITE ECCOBOND EN 3707F, deliver an impermeable barrier to potential environmental influences and offer manufacturers cure process flexibility and deposition traceability.

Henkel Electronic Materials

Krayden, Inc. Introduces Expanded New Line Card for 2009

Industry News | 2009-04-08 16:12:41.0

DENVER � April 2009 � Krayden, Inc., a leading distributor of engineered materials, introduces an updated and expanded line card, detailing its services and manufacturers.

Krayden Inc.

Krayden, Inc. Announces that Humiseal UV40 Coating Is Available as a Gel

Industry News | 2010-06-11 15:24:29.0

DENVER, CO — Krayden, Inc., a leading distributor of engineered materials, announces that the popular Humiseal UV40 conformal coating is now available as a gel.

Krayden Inc.

Unigen Offers In-House Conformal Coating as an Added Value to Its Manufacturing Services

Industry News | 2022-09-15 06:32:01.0

Unigen Corporation is pleased to offer cutting edge in-house conformal coating as a value-add service for customers who require additional protection and reliability for ruggedized environments.

Unigen Corporation

Henkel's New Wafer Backside Coating� Portfolio Revolutionizes Die Attach Processes

Industry News | 2008-08-01 00:29:58.0

With the well-respected die attach brands of Hysol� and Ablestik�, Henkel has long been recognized for consistently pushing the bar higher when it comes to advanced semiconductor materials development. This pioneering philosophy has led to the development of yet another groundbreaking materials advance and the launch of Henkel's Ablestik 8000� Wafer Backside Coating� (WBC) technology.

Henkel Electronic Materials

Nordson MARCH MesoSPHERE Plasma Systems Enable Very High Throughput Processing for 3D and Wafer-level Package Assembly

Industry News | 2018-02-01 20:18:01.0

Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. The MesoSPHERE's new, patented W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly. Tight control over all process parameters gives highly repeatable results.

MARCH Products | Nordson Electronics Solutions


secondary cure dymax searches for Companies, Equipment, Machines, Suppliers & Information

thru hole soldering and selective soldering needs

Training online, at your facility, or at one of our worldwide training centers"
High Throughput Reflow Oven

High Resolution Fast Speed Industrial Cameras.
SMT feeders

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
design with ease with Win Source obselete parts and supplies

Thermal Transfer Materials.