Technical Library | 2013-08-08 15:23:11.0
In this project Machine Vision PCB Inspection System is applied at the first step of manufacturing, i.e., the making of bare PCB. We first compare a PCB standard image with a PCB image, using a simple subtraction algorithm that can highlight the main problem-regions. We have also seen the effect of noise in a PCB image that at what level this method is suitable to detect the faulty image. Our focus is to detect defects on printed circuit boards & to see the effect of noise. Typical defects that can be detected are over etchings (opens), under-etchings (shorts), holes etc...
Technical Library | 2016-06-30 14:00:32.0
When designing PLLs in nanometer CMOS, it is essential to validate the closed-loop PLL performance metrics with nanometer SPICE accuracy before going to silicon. Transistor-level, closed-loop PLL verification has been impractical due to traditional SPICE and RF simulator performance and capacity limitations. By using Analog FastSPICE, designers dont have to trade accuracy for performance. Read this white paper to see how AFS: Delivers closed-loop PLL transistor-level verification Supports direct jitter measurements Produces phase noise results correlating within 1-2dB of silicon
Technical Library | 2019-05-16 02:25:15.0
limatest Symor wants to tell you that humidity is not only the most important thing in the chamber, but also the temperature In order to facilitate customers to add water, our temperature and humidity test chamber is to place the water tank at back of the equipment.Just open the baffle to see the water tank and the water level meter next to the tank,then add enough water to the tank. However, in addition to manual water addition, our temperature and humidity test chamber has equipment that can automatically add water. Only by connecting the water pipe at the water filling port can it be automatically replenished when there is a shortage of water, which is suitable for high humidity test for a long time.
Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
Technical Library | 2016-08-02 06:04:42.0
The next generation FUNDAS rest on one and only one motto (i.e.) technology up-gradation. For innovations in any corner of the world, a completely unique electronic solution is derived that accounts for fast trending modernization in the lifestyle of humans. With electronic design or manufacturing solution, the printed circuit boards are the groundwork for every electronic project. As the electronic control system and instruments are now applied in every predominant market across the globe, the use of PCB is predicted to have universal application in the global society. This article details you on the type of PCB’s used in the industrial sector, the application of PCB and innovations marked in the industrial sector with current steps taken by PCB manufacturers to provide unique solutions to the industrial sharks. See more: http://www.technotronix.us/pcbblog/printed-circuit-board-for-industrial-application-drives-a-wave-of-innovation/
Technical Library | 2017-04-28 07:53:37.0
A major drawback to Industry 4.0 that few write about is maintenance of an industry 4.0 plant. The maintenance aspect is a much greater and immediate drawback than even the commonly known major concern of security, and the lesser concern of system integration standards. Maintenance of 4.0 systems has, and will continue to result in related huge increases in process downtime. The barriers to overcoming the maintenance/downtime drawbacks of a 4.0 system are almost insurmountable. Has the Smart Manufacturing Leadership Coalition (SMLC) addressed the maintenance paradox? “... model also demands the ability to calculate and manage risk and uncertainty within very different operating structures. ..” Continue reading in pdf or for even more see and share http://bin95.com/Industry40inUSA.htm
Technical Library | 2018-12-05 14:52:23.0
The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of material and process changes such as the shift from precious metal electrode (PME) configurations which were predominantly silver/palladium to base metal electrodes (BME) dominated by nickel. Each of these changes were accompanied by both quality and reliability problems. The MLCC industry is now in the midst of an unprecedented set of challenges similar to the Moore’s Law challenges being faced by the semiconductor industry. While capacitor failures have historically been responsible for a significant percentage of product field failures (most estimates are ~30%) we are seeing disturbing developments in the low voltage (
Technical Library | 2019-02-25 05:24:53.0
"The idea of the value chain is based on the process view of organizations, the idea of seeing a manufacturing (or service) organization as a system, made up of subsystems each with inputs, transformation processes and outputs".[1] The definition of a value-added chain by Michael E. Porter is one of many to be found in reference books, works and on websites. In principle, it involves a sequence of activities, executed by a manufacturing company to develop, produce, sell, ship, and maintain products or services. Three main parameters essentially influence a value-added chain: Direct activities − research, development, production, shipment etc. Indirect activities − maintenance, operation, occupational safety, environment etc. Quality assurance − monitoring, test/inspection; quality management etc. In particular, indirect activities and quality assurance generate a greater part of the costs in product manufacturing. This article principally focusses on the indirect activities, among them air purification.
Technical Library | 2023-11-20 18:18:34.0
When x-ray inspection is used as part of a quality assurance program for any assembled device, steps must be taken early in the design stage to anticipate the use of x-ray inspection later in the development and production processes. This is a lesson that electronic assembly manufacturers learned years ago, and that medical device manufacturers are also discovering. There are several steps involved in learning how to interpret x-ray images, and how to design for x-ray inspection. First, manufacturers need to understand the nature of the x-ray shadow and its modalities; then they need to see how medical device developers and manufacturers are using x-ray inspection; finally, they need to consider taking measures early in the design process to ensure a clear, accurate image when the assembled device undergoes x-ray inspection.
Technical Library | 2024-09-02 17:31:09.0
The cracking and delamination of printed circuit boards (PCB) during exposure to elevated thermal exposure, such as reflow and rework, have always been a concern for the electronics industry. However, with the increasing spread of Pb-free assembly into industries with lower volume and higher complexity, the occurrence of these events is increasing in frequency. Several telecom and enterprise original equipment manufacturers (OEMs) have reported that the robustness of their PCBs is their number one concern during the transition from SnPb to Pb-free product. Cracking and delamination within PCBs can be cohesive or adhesive in nature and can occur within the weave, along the weave, or at the copper/epoxy interface (see Figure 1). The particular role of moisture absorption and other PCB material properties, such as out of plane expansion on this phenomenon is still being debated.
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