Full Site - : semiconductor packaging (Page 2 of 422)

MIRTEC Receives 2008 Advanced Packaging Award for Their MV-7L In-Line AOI Machine

Industry News | 2008-07-19 15:38:37.0

OXFORD, CT � July 16, 2008 � MIRTEC, the global leader in Automated Optical Inspection Technology, announces that its MV-7L In-Line AOI System was named First Finalist in the category of Inspection Equipment & Services during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.

MIRTEC Corp

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Camtek Introduces the Dragon, a New, Fast AOI System with Fully-automated Material Handling

Industry News | 2003-03-25 09:15:19.0

The Dragon was demonstrated at the CPCA show in Shanghai last week

SMTnet

MIRTEC Announces Technical Collaboration with Universal Instruments’ Advanced Process Lab

Industry News | 2019-10-21 16:37:01.0

MIRTEC is pleased to announce that it has installed one of its Award-Winning MV-6 OMNI 3D AOI Systems at Universal Instruments’ Advanced Process Lab (APL) in Conklin, New York. Universal’s APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability.

MIRTEC Corp

Shipley Company Announces Distribution Agreement with Unichem Industries

Industry News | 2003-04-18 08:31:57.0

Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.

SMTnet

Shipley Company Announces New Appointments for Printed Wiring Board Business in North America and Europe

Industry News | 2003-05-02 08:58:57.0

Bob Ferguson has been appointed PWB General Manager, North America.

SMTnet

MIRTEC to Introduce MV-9 SIP and MP-7 MICRO at SEMICON West

Industry News | 2014-06-22 19:12:37.0

MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.

MIRTEC Corp

YXLON International and MIRTEC Announce Close Cooperation Empowering Industry 4.0 in the Electronics Production Market

Industry News | 2015-05-07 19:28:29.0

MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.

MIRTEC Corp

DuPont Electronic Technologies' Printed Circuit Materials Division Announces Price Increase for Riston� Photopolymer Dry Film Resists

Industry News | 2003-06-04 08:27:58.0

DuPont cites rising raw material, transportation and energy costs as reasons for the increase.

SMTnet

International Rectifier Introduces Bi-Directional Dual MOSFET in the FlipFET Package

Industry News | 2003-01-29 13:23:31.0

A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package

SMTnet


semiconductor packaging searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

High Precision Fluid Dispensers
PCB Handling with CE

High Throughput Reflow Oven
PCB Handling Machine with CE

Best Reflow Oven
Selective soldering solutions with Jade soldering machine

Training online, at your facility, or at one of our worldwide training centers"
Hot selling SMT spare parts and professional SMT machine solutions

"回流焊炉"