Electronics Forum | Mon Dec 05 09:31:19 EST 2005 | whippingpost
Not all but some were tested O.K before the failure. What are some of the other reasons for ball separation from the component body besides mechanical stress?
Electronics Forum | Mon Mar 20 00:48:22 EST 2006 | pavel_murtishev
Good morning, In this case separation speed doesn�t affect print quality. Separation speed decrease makes print quality the same or worse. Apertures still remain blocked. Any ideas? Thanks. BR, Pavel
Electronics Forum | Thu Mar 23 10:21:38 EST 2006 | chatech
Recently my company (graphic card suppliers) have experenced some pad to board separation under the processor. I have researched and find that a number of papers have been written about this, but they give no solution, Is anyone out there experencing
Electronics Forum | Tue Aug 01 10:28:35 EDT 2006 | azbvc
Hi Davef, Could you elaborate more on faster separation speed is better of paste release. Any DOE have you performed before to prove that. My current paste printing practice is to make separation speed slow. Please advise.. rgds
Electronics Forum | Wed Feb 04 22:01:48 EST 2015 | daniellarios
But do you separate this waste from others. Or do you separate by plastic? Because if you do the second it would be easier to find a way to recycle. Do you use an optic sorter ?
Electronics Forum | Mon Jul 31 11:06:45 EDT 2017 | capse
Fancort industries offers v-score separation systems. ASYS Group offers sawing and router depanel equipment.
Electronics Forum | Thu Mar 14 17:58:20 EDT 2024 | mistrthou
We took an example to a local metal recycler. They wanted us to separate the outer aluminum from the inner stainless, then they scrapped them separately.
Electronics Forum | Mon Nov 08 19:10:10 EST 1999 | Brian W.
Oh boy, does that bring back memories!!!!! You are most likely breaking components when the board is flexed during separation. Any components perpendicular to the score are candidates for mechanical stress. We overcame the problem by making our ow
Electronics Forum | Mon Jul 08 09:52:37 EDT 2002 | gdstanton
Folks, Looking for some feedback from anyone who has had experience with panelized or palletized CCAs, or anyone interesting on commenting, where interconnects were used to facilited a "gang" incircuit and functional test. We are considering implem
Electronics Forum | Thu Nov 17 15:40:23 EST 2005 | Hoss
We have a board that has been diagnosed with inner layer separation from the barrel wall. This board is .093 thick and 12 layers. Several layers, in some cases, have little or no thermal relief making soldering difficult. We have since switched t
