Industry News | 2014-09-05 13:53:06.0
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
Industry News | 2011-06-07 14:22:50.0
Krayden introduces Dow Corning’s 3145 RTV Silicone Adhesive. The adhesive is available in gray or clear, and is ideal for sealing openings in modules or around electrical wires and leads.
Industry News | 2014-08-14 21:44:44.0
Several Indium Corporation experts will share their technical knowledge with attendees at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.
Industry News | 2016-04-26 10:26:58.0
SHENMAO Technology, Inc. will present the technical paper “A New Dispensing Solder Paste for Laser Soldering Technology” at the 10 th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.
Industry News | 2014-08-28 15:48:58.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. Evstatin Krastev, Director of Applications, will present two papers at the upcoming SMTA International exhibition.
Industry News | 2007-12-19 15:13:53.0
OSAKA, JAPAN � December 17, 2007 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will present during the 13th Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition that is scheduled to take place January 22-24, 2008 at the Sheraton Kauai Resort, in Kauai, Hawaii.
Industry News | 2016-12-12 05:28:06.0
The following webinars are available free online throughout 2017 and are organised by Bob Willis for NPL. A direct link is provided for each event to allow you to book online
Industry News | 2014-12-11 17:22:23.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), continues to meet the challenges for micro materials testing with the introduction of a new test method for the evaluation of die strength by means of cantilever bending where 3 point bending is not suitable for die with a thickness of less than 50 microns.
Industry News | 2014-07-28 13:56:52.0
240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
Industry News | 2015-03-20 09:51:33.0
THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION
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