Electronics Forum | Tue May 23 13:08:54 EDT 2000 | John Thorup
I second Wolfgang. Welcome, It's good to hear from someone who wants to design something we can build. Another useful resource is the land pattern book from SMT Plus www.smtplus.com 831/438-6116 Also useful are the component mechanicals available (fr
Electronics Forum | Wed Jun 20 12:07:13 EDT 2001 | Steve
I would suggest getting a copy of IPC-SM-782A, Surface Mount Design and Land Pattern Standard, and IPC-7525 Stencil Design Guidelines. My experience is that reflow does not cause tombstoning very often. Pad and land design, paste volume, and placemen
Electronics Forum | Wed Dec 01 10:14:41 EST 1999 | Wolfgang Busko
Hi Steve, the "framepiece" I mentioned may be misunderstanding but sometimes I don�t know the common english expression. What I meant is if the PCBs do not come in panels (now you mentioned 3-up panel)the PCB supplier could add additional material to
Electronics Forum | Tue Jun 25 13:30:42 EDT 2002 | Jeff Park
Folks, I am interested in learning more about solder robbing pads to help and avoid bridging for wave solder applications. I have heard of a few companys that use this process in their design but have not seen any documents for design rules etc.
Electronics Forum | Mon Oct 06 08:51:26 EDT 2003 | davef
The EIA does not provide that information. EIA standards focus on component dimensions. Alternately consider: ...cut... SM-782A - Surface Mount Design & Land Pattern Standard, Inc. Am. 1 & 2 ANSI Approved Get up-to-date land pattern recommendat
Electronics Forum | Mon Jun 25 20:54:28 EDT 2001 | davef
No, I�m suggesting an increase in the distance between the two pads on the board. This "G" in SM-782A "Surface Mount design & Land Pattern Standard" parlance. You shouldn�t fight solder balls for long periods. You should just increase the pressure
Electronics Forum | Thu Jul 08 12:33:52 EDT 1999 | Mike Demos
Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. I wi
Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc
Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components
Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef
From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ
Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&
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