Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:30u” Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Fi
New Equipment | Fabrication Services
Our Service PCB Assembly and PCB&PCBA design are our main business.We are able to undertake a high quality Printed Circuit Board Assembly on competitive prices and flexible conditions.We are a complete “One- Stop” resource for printed circuit board
New Equipment | Fabrication Services
Gold Finger PCB No of layer: 6 layer Material: FR-4, TG170 Thickness: 1.6mm Copper thickness: 35um copper/1oz Yellow Solder Mask Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um Special technology: gold finger/Edge connector plating, go
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 1 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Gold finger 40 microinch, bevelled. 6). HASL + Gold finger, ENIG + gold finger 7). Larg volum, punch contour.
FR-4 Material 2.4 mm Thickness 4 Layers Lead Free Surface Treatment Red Solder Mask Gold Finger
Used SMT Equipment | Soldering - Wave
Speedline Technologies Electrovert EPK Gold Wave Solder Machine - just removered from production in working conditon. Currently in production and available now. 11/2005 DOM, 208VAC 3 Phase Power, Reciprocating Spray Fluxer, L to R Board Flow, Heavy D
REPAIR & REWORK OF GOLD CONTACTS, E.G. GOLD FINGER,CONNECTORS, SOLDER ON GOLD PROBLEM, COSTUME JEWELLERY, DENTAL, OPTICAL, ETC.
Parts & Supplies | Tape and Reel
High Temperature Masking dots High temperature masking tape and dots are ideal for masking gold fingers of printed circuit boards during wave solder or solder dip process, as well as for solder wave masking and electrical insulation. The p
The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m
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