Electronics Forum | Tue Jan 12 17:51:41 EST 1999 | Tom Gervascio
I've been using selective soldering process for about 18 months. The major problem concerns tight spacing- the distance between the SMT pads to be masked and the thru hole leads to be wave soldered should be no less than 0.150 inches. Keep the wall
Electronics Forum | Fri Aug 13 10:19:35 EDT 1999 | Boca
| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave
Electronics Forum | Wed Feb 20 19:57:27 EST 2002 | davef
THIEVING * Layout: I�d guess the surface area of your thieves is not large enough. The pull from the thief is not great enough to over-come the pull from the connector pins and pads. Consider tripling the size of the thief. As you say, reducing t
Electronics Forum | Wed Jul 02 09:22:20 EDT 2008 | dmunson
Thanks Real Chunks. We currently have an RPS opus selective solder machine that we plan on keeping. It is configured as a 3-nozzle (!) one-pump (!!) point selective solder machine w/ nitrogen preheat. Custom wet nozzles. We use lead free SN100C sold
Electronics Forum | Thu Jul 15 14:55:24 EDT 1999 | JohnW
| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa
