The little big one from Ersa in selective soldering - SMARTFLOW 2020: compact without compromises, extremely smart! Winner of the GTI Award 2015. Find our products ? https://www.kurtzersa.com/electronics-production-equipment/soldering-machines/select
Industry Directory | Manufacturer
Radiotronix set as its goal to create a new generation of highly-integrated IC-style RF module that combined ease of use, enhanced performance and lowered customer cost.
Technical Library | 2021-11-03 17:05:39.0
Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.
The little big one from Ersa in selective soldering - SMARTFLOW 2020: compact without compromises, extremely smart! Winner of the GTI Award 2015. Find our products ? https://www.kurtzersa.com/electronics-production-equipment/soldering-machines/select
New Equipment | Board Handling - Storage
Stentech's Vacuum Plates provide support for the circuit board during the assembly process. Because we now manufacture highly complex and dense boards, this has become critical to avoid warping, sagging, and bending of the board. Vacuum plates wil
New Equipment | Industrial Automation
Skype^ : dddemi33 Sales&Manager : Tiffany Guan RFQ#e-mail : plcsale@mooreplc.com Whats@app : +86 18030235313 Relatied In Stock Items : (Competitive Price) TRICONEX 3604E TRICONEX 3664 TRICONEX 3700A TRICONEX 3721 TRICONEX 4119A TRICONEX
New Equipment | Industrial Automation
Skype^ : dddemi33 Sales&Manager : Tiffany Guan RFQ#e-mail : plcsale@mooreplc.com Whats@app : +86 18030235313 Relatied In Stock Items : (Competitive Price) TRICONEX 3604E TRICONEX 3664 TRICONEX 3700A TRICONEX 3721 TRICONEX 4119A TRICONEX
New Equipment | Industrial Automation
Skype^ : dddemi33 Sales&Manager : Tiffany Guan RFQ#e-mail : plcsale@mooreplc.com Whats@app : +86 18030235313 Relatied In Stock Items : (Competitive Price) TRICONEX 3604E TRICONEX 3664 TRICONEX 3700A TRICONEX 3721 TRICONEX 4119A TRICONEX
New Equipment | Industrial Automation
Skype^ : dddemi33 Sales&Manager : Tiffany Guan RFQ#e-mail : plcsale@mooreplc.com Whats@app : +86 18030235313 Relatied In Stock Items : (Competitive Price) TRICONEX 3604E TRICONEX 3664 TRICONEX 3700A TRICONEX 3721 TRICONEX 4119A TRICONEX
New Equipment | Industrial Automation
Skype^ : dddemi33 Sales&Manager : Tiffany Guan RFQ#e-mail : plcsale@mooreplc.com Whats@app : +86 18030235313 Relatied In Stock Items : (Competitive Price) TRICONEX 3604E TRICONEX 3664 TRICONEX 3700A TRICONEX 3721 TRICONEX 4119A TRICONEX