Electronics Forum | Fri Oct 23 17:33:42 EDT 2009 | grizzy
Check that you are following the moisture sensitivity requirements for the part. I've seen the part swell underneath. You can contact me at wenroth@reconsales.com for more information. I am an 'ol reflow guy from the CM world. Wes
Electronics Forum | Fri May 21 09:48:30 EDT 2010 | tomg_fla
Am looking for a dispensable water soluble solder mask or peelable solder mask that can be dispensed and be run through a reflow oven with no swelling or degradation. Any leads on any materials or manufacturers to contact?
Electronics Forum | Mon May 24 12:05:53 EDT 2010 | deanm
Did you try Techspray Wondermask W? It is water soluble and can probably be transferred from the bottle to an EFD type syringe for dispensing (we use the P and the PL that way). As far as if it will swell through the reflow, I don't know. We don't us
Electronics Forum | Sun Jun 29 07:31:03 EDT 2014 | vitrost
Hi, We had experienced very similar issue on boards of a certain PCB manufacturer. Field experiments showed that the solder mask of this manufacturer is prone to swelling and peeling after it was in contact with our water-based flux. When you switc
Electronics Forum | Thu Feb 07 12:04:11 EST 2019 | davef
Over the years, Bob has contributed many videos and pictures that have help identify and solve production issues. I recall a vid of a bug-up BGA being heated to liquious that showed the balls swelling in the heat to the level that they bridged. Bril
Electronics Forum | Tue May 02 17:26:33 EDT 2000 | Steve Thomas
As I understand it, though, a 90 sec. 75F wash and a 15 second rinse (plus the lift cycle, another 10 secs., perhaps) at a MAX. of 110F isn't supposed to be nearly enough of a swing to swell that epoxy or expand the foil. According to my contacts at
Electronics Forum | Wed Nov 10 16:19:51 EST 2010 | davef
The 5 thou standoff of your SOIC is probably the minimum. We wouldn't be surprised to see 10 thou. With this, you could have maybe a 6 thou gap between printed solder paste and the bottom of the heat slug. So, you're expecting the rabbit ears of p
Electronics Forum | Thu May 24 08:40:18 EDT 2001 | toolman
hi kris well 0.02 cents south african money is a lot less. but anyway we have a customer with 3 lines all lines are the same equipment and we have had major problems with 0402s .on some manf reels .as a test we moved one reel around and the problem m
Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber
There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det
Electronics Forum | Tue Nov 16 14:10:30 EST 1999 | Bill Schreiber
According to a paper by Richard Clouthier, published in 1996, there are two major factors about normal cleaning chemistries that may affect stencil adhesives. 1) Elevated temperature above 110 degrees F. (45 degrees C). Stencil adhesives are heat c
