Industry News | 2008-04-10 13:53:26.0
NORTH BILLERICA, Mass., April 10, 2008 � BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, has been awarded an EM Asia Innovation Award in the category of Environmentally Friendly/Alternative Energy Production Equipment for its In-Line Diffusion System. The award was presented to the company during Nepcon China 2008.
Technical Library | 2021-12-29 19:52:50.0
Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs.
Industry News | 2012-03-07 17:22:57.0
BTU International will highlight its next-generation thermal processing equipment in Booth A780-782 and its representative, DCT’s booth A-482, at the International Green Energy Expo. BTU experts will be on hand to discuss advanced thermal processing solutions for photovoltaics including metallization, diffusion and annealing.
Technical Library | 2010-07-08 19:49:59.0
Aging characteristics of new lead free solder alloys are in question by many experts because of higher amount of tin’s effect on the diffusion of other metals, primarily copper, to create undesirable boundary intermetallics over long periods of time and even moderately elevated temperatures. A primary layer of intermetallics, Cu6Sn5 forms as the liquid solder makes contact with the solid copper substrate. This reaction however ceases as the solder temperature falls below that of liquidus. A secondary intermetallic Cu3Sn1, an undesirable weak and brittle layer, is thought to form over time and may be accelerated by even mildly elevated temperatures in electronic modules such as laptops under power. This project was designed to quantify the growth rate of Cu3Sn1 over an extended period of time in a thermal environment similar to a laptop in the power on mode.
Industry News | 2011-01-10 13:45:58.0
BTU International today announced the receipt of two new orders for Meridian™ in-line diffusion furnaces. The orders, valued in excess of $18 million , were received from a new and an existing customer based in Asia.
Industry News | 2014-10-15 15:32:17.0
BTU International, Inc. announces that it will exhibit with its representative Gemmy-Tek Technology Co., Ltd., in Booth A0306 at PV Taiwan, scheduled to take place October 22-24, 2014, at TWTC Exhibition Hall 1.
Industry News | 2014-05-14 17:36:38.0
BTU International, Inc. , will highlight the company’s new Stacked Wafer Inline Furnace Technology (SWIFT), ultra-high throughput technology for solar cell diffusion, in booth E3-210 at the 8th SNEC Power Expo 2014, scheduled to take place May 20-22, 2014, at the Shanghai New International Expo Center in Shanghai, China.
Industry News | 2010-12-09 13:10:47.0
Krayden introduces Dow Corning's 702 Diffusion Pump Fluid, designed for high vacuum and fast pumping of large volumes of gas or vapor in production.
Industry News | 2008-10-13 01:25:05.0
NORTH BILLERICA, Mass., Oct. 9, 2008�BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, today announced that it will exhibit in booth 1828 at the upcoming Solar Power International Exhibition and Conference in San Diego. The exhibition is being held on October 13-16.
Industry News | 2010-09-01 13:11:03.0
BTU International, a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, will highlight its next generation thermal processing capabilities at the 25th European Photovoltaic Solar Energy Conference and Exhibition (6 - 9 September 2010) to be held at the Feria Valencia in Valencia, Spain. BTU’s booth number is L2/H2/A5.
