Used SMT Equipment | General Purpose Test & Measurement
Hepco 7900-LF3 DIP Lead FormerSN: 1703 General specs:Series 7900 Convertible DIP Lead FormersAutomatically Adjusts for Body Thickness Variations.One Machine for .300", .400" and .600" DIPS Fast, Simple Conversion - Under 2 Minutes.Fixed Tooling Means
Used SMT Equipment | SPI / Solder Paste Inspection
3D SPI system inline 3 D camera min. paste size 150x150µm max. paste size 20x20mm max. paste hight 1000µm min. PCB size 50x50mm max. PCB size 500x510m PCB thickness 0,4mm - 4mm measurements 1060mm (width) x 1285mm (length) x 1400mm (hight) weight 10
Used SMT Equipment | In-Circuit Testers
TAKAYA APT9411CE Needle count: the upper 4 (movable) under lateral 2 rings (not moving) Detection speed: the highest 0.08 ~ 0.08 SEC/step Repeated positioning accuracy within + - 50 um Tip the minimum test distance is about 0.2 mm Maximum size p
Used SMT Equipment | General Purpose Test & Measurement
Nutek NTM4610-X Laser Marker (2006) Brand: Nutek Model: NTM4610-X Type: Laser marker Serial #: 2006-0096B01 Year: 2006 Conveyor: Automatic Camera type: Hawk eye 1500 Interface: Smema Operational system: Microsoft Windows 2000 Pressure: 4-6
Used SMT Equipment | SPI / Solder Paste Inspection
Vi Technology 3D SPI 3D Solder Paste Inspection System Model: 4000L 3D SPI Year: 2009 Accuracy and warp compensation Unmatched true resolution, accuracy and repeatability Full-featured absolute measurement of the full board surface, mapping to
Used SMT Equipment | SPI / Solder Paste Inspection
Agilent SP50 Series II 3D SPI 3D Solder Paste Inspection System Model: SP50 Series II Vintage: 2006 Maximum board size: 510 by 510 mm (20 by 20 in) Minimum board size: 50 by 50 mm (1.97 by 1.97 in) Maximum board thickness: 4 mm (0.16 in) 2D an
Used SMT Equipment | SPI / Solder Paste Inspection
ASC International LaserVision SP3D-ADC - 3D Solder Paste Inspection - Benchtop - Model: SP3D-ADC - Automatic Data Collection (ADC) for real-time control of SMT stencil printing - 3D Profiling Capabilities - Windows® XP interface Operating Sy
Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE300 Ultra 3D SPI 3-D Solder Paste Inspection Machine Model: SE300 Ultra Vintage: 2008 Good Functional Condition - Recently Taken Offline Multi-Panel 1-D and 2-D Barcode Read w/ System Sensor Mechanical Board Stop Solution Less th
.jpg)
Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE300 (2004) Solder Paste Inspection Brand: Cyberoptics Model: SE300 Description: Solder Paste Inspection Serial: 10239 Year: 2004 Details: • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max pad size
