Electronics Forum | Thu Aug 05 14:45:03 EDT 2004 | davef
Bright vs matte tin is fairly easy, but there's a s whole bunch of alternatives, beyond those two choices. So, no, not that we know.
Electronics Forum | Wed May 03 05:11:36 EDT 2006 | Rob
Hi Pat, The Congo has been producing tin at current rates for at least the last decade, the ROHS directive won't change anything there. The current black market can't expand to cover the extra tin requirements and still be a back door operation. I
Electronics Forum | Wed Oct 08 06:55:36 EDT 2003 | christ
Hi Dave: Thanking in advance for your valuable response!
Electronics Forum | Wed Aug 04 18:38:53 EDT 2004 | davef
whiskers / "matte" => no whiskers. Look here: http://nepp.nasa.gov/whisker/anecdote/20year/ There. Nice going. What a buzz killer. I've got to got find some donuts, cold pizza, er whatever.
Electronics Forum | Thu Aug 05 10:55:19 EDT 2004 | jim_bob
Thanks. Yes, this is a interesting topic, and one that keeps our component engineers busy these days. I'm familiar with the data you referenced. Is there a "easy" method (test method) to use at incoming inspection to verify a termination is "matte
Electronics Forum | Tue May 02 15:05:25 EDT 2006 | patrickbruneel
The other side of the lead-free coin http://money.cnn.com/magazines/fortune/fortune_archive/2006/05/01/8375451/index.htm
Electronics Forum | Fri Oct 13 10:35:06 EDT 2006 | patrickbruneel
I just hope that lead-free alloys will only be used in tropical climates and above 13 C. Check here: http://materials.open.ac.uk/srg/srg_tp.htm Patrick
Electronics Forum | Fri Oct 13 11:55:23 EDT 2006 | patrickbruneel
I just hope that lead-free alloys will only be used in tropical climates and above 13 C. Check here: http://materials.open.ac.uk/srg/srg_tp.htm Patrick
Electronics Forum | Fri Jan 27 11:30:47 EST 2006 | solderiron
Kester is offering a tin/copper alloy for lead free. Any comments regarding using just tin/copper as opposed to tin/silver/copper or tin/nickel/copper? the price is low but why wouldn't everyone else offer just this alloy as opposed to the standard S
Electronics Forum | Tue Mar 01 10:21:55 EST 2005 | davef
IPC Plating Committee is presently working on a specification for immersion tin [IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards] as a solderable surface finish. Immersion tin is normally deposited at 30 to 60 microinches.
