Electronics Forum: toe (Page 2 of 19)

QFNs (LCCs)

Electronics Forum | Fri Dec 22 11:32:56 EST 2006 | realchunks

We generaly reduce 25% and get great heat sink capability. Mind you that we do not perferate the pad with vias as recommended. Our toe ends are not plated, so getting any toe fillet is impossible.

What is 'toe down configuration' 8.2.5.6 IPC-A-610D?

Electronics Forum | Tue Apr 10 20:54:09 EDT 2007 | raychamp007

Dear Friend, Can any one explain what is 'toe down configuration' stated in 8.2.5.6 IPC-A-610D? Can any one here to explain in more details. Thanks

What is 'toe down configuration' 8.2.5.6 IPC-A-610D?

Electronics Forum | Thu Apr 12 08:16:19 EDT 2007 | davef

Toe down solution: * Land pattern design * Solder stencil design * Proper component fabrication Normal gull wing lead solder requirement: Solder must extend to the mid-point of the outside of the lead bend.

ENiG or IAg? Which is better?

Electronics Forum | Thu Mar 06 13:12:55 EST 2008 | shrek

KRIKIES Chunks me-lady. Yellow toe-nails with tree rosin will definitely sodder that there immersion silver. Sounds like i have met me match. Who is this fella with the toe-nails?

Solder cover

Electronics Forum | Mon May 17 22:46:02 EDT 2010 | qaace

IPC also states that side overhang on a gull wing of 50% is acceptable for Class 2. Does anyone know if that interprets to only one side having a fillet? Also with toe overhang acceptable, there need not be a toe fillet.

How to improve the solder quality of QFN?

Electronics Forum | Wed Jul 06 14:36:05 EDT 2005 | Bob R.

The only way we can consistently get a toe fillet is to use a paste with an extremely active flux. We allow that paste on certain products, but discourage it's use because it's on the hairy edge of not meeting our lower limit in surface insulation r

FLAT LUG LEADS (USBS & SOD123 DIODES) - TOE WETTING

Electronics Forum | Mon Jul 31 03:50:26 EDT 2023 | calebcsmt

Is below the correct interpretation of IPC 610/JSTD requirements for FLAT LUG LEADS (seen on USBs and Diodes mainly) For class 1 or 2, no toe wetting would be required as minimum side joint is only 'evident wetting' and no actual length or fillet he

QFP footprint -extended outside pad?

Electronics Forum | Fri Sep 16 08:01:06 EDT 2011 | davef

We see no advantage to extending the toe-end of pads. Hell, 90 percent of the time the numb-end of the toe of the component lead isn't plated. So, it doesn't take solder. Further, solder on the toe adds little, if anything to the strength on the sold

Fine Pitch QFP100 Solder Joint - Need Help!

Electronics Forum | Wed Oct 30 23:19:28 EST 2002 | caldon

Is toe fillet still required?

Toe Fillets

Electronics Forum | Thu Jan 08 16:24:15 EST 2004 | Dean

I agree 100% The strength of the joint is contained at the interface. Ever seen a fillet on a mail stamp?


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