New SMT Equipment: vapor not phase (Page 2 of 8)

RD10 - Vapor Phase Reflow System

RD10 - Vapor Phase Reflow System

New Equipment |  

R&D Technical Services offers a full line of Single Vapor Reflow Systems. The RD10 provides consistent, uniform and reliable heat transfer in a Belted Inline application for high quality reflow, curing and drying. The RD10 utilizes user friendly cont

R&D Technical Services, Inc.

RD1 - Vapor Phase Reflow System

RD1 - Vapor Phase Reflow System

New Equipment |  

R&D Technical Services Inc. offers a full line of Single Vapor Batch Type Reflow Systems. The RD1 provides consistent, uniform and reliable heat transfer for high quality reflow, curing and drying. The RD1 utilizes Programmable Logic Controls coupled

R&D Technical Services, Inc.

VP Nano system

New Equipment | Soldering - Other

VP Nano system allows engineers to capture thermal profiles of complex electronic assemblies that utilise numerous components or require higher mass PCB substrates. Thanks to its innovative design, the system will streamline the periodic checking of

Solderstar

VRS - Vapor - Recovery System

VRS - Vapor - Recovery System

New Equipment |  

The R&D Technical Services VRS unit was specifically designed to treat the external exhaust of reflow systems. The VRS is used to minimize fluid consumption which significantly reduces operating costs. APPLICATION: The model VRS is a high performance

R&D Technical Services, Inc.

Asscon VP6000 with Vacuum

Asscon VP6000 with Vacuum

New Equipment | Reflow

ASSCON’s vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal f

A-Tek Systems Group LLC

Asscon VP7000 with vacuum

Asscon VP7000 with vacuum

New Equipment | Reflow

ASSCON vapor phase reflow soldering systems set standards in soldering technology. The VP 7000 vacuum systems are based on advanced patented high-tech soldering methods, and offer outstanding soldering quality in large series productio

A-Tek Systems Group LLC

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

New Equipment | Solder Materials

NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC

AIM Solder

Advanced Thermal Management

Advanced Thermal Management

New Equipment | Assembly Services

S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with

S-Bond Technologies

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste

New Equipment | Solder Materials

8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr

Henkel Electronic Materials

Conformal Coating Services

Conformal Coating Services

New Equipment | Assembly Services

Para Coat Technologies was established in 2009. PCT is a manufacturing service provider specializing in the application of Parylene conformal coating and also provides Acrylic, Silicone and Urethane conformal coating along with Parylene Equipment Sal

Para Coat Technologies


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