With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Industry News | 2019-05-16 01:24:13.0
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.
Industry News | 2021-12-08 20:48:30.0
With the development of motor technology, compressor is considered as "general machinery", especially in coal chemical industry, machinery industry and other industries. For distance measurement applications, both incremental and absolute encoders can be chosen - from a technical point of view. The advantages of absolute encoders are reflected in accuracy and performance, while incremental encoders seem more economical and practical. A correctly working compressor determines the safe operation of the whole air conditioner or refrigerator. For example, during the operation of piston compressor, there would be burnout, oiler failure or low pressure and gas shortage. Once these problems occur, the appliance would not work right. How to quickly and accurately detect and solve these problems in time affects the compressor operating rate and product output. This article will analyze all common faults of AC compressors and provide solutions.
The LeanCNCell is a production system designed to handle all metering and dispensing tasks for small and medium-sized batch production. Standard applications include applying or sealing of electronic assemblies and their housings with 1D, 2D or 3D co
Industry News | 2012-11-06 11:22:15.0
Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.
Technical Library | 2021-06-21 19:34:02.0
In this era of electronics miniaturization, high yield and low-cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip to board. In order to maximize substrate real-estate, the distance between Cu traces also known as line and space (L/S) should be minimized. Typical PCB technology consists of L/S larger than 40 µ whereas more advanced wafer level technology currently sits at or around 2 µm L/S. In the past decade, the chip size has decreased significantly along with the L/S on the substrate. The decreasing chip scales and smaller L/S distances has created unique challenges for both printed circuit board (PCB) industry and the semiconductor industry. Fan-out panel-level packaging (FOPLP) is a new manufacturing technology that seeks to bring the PCB world and IC/semiconductor world even closer. While FOPLP is still an emerging technology, the amount of high-volume production in this market space provide a financial incentive to develop innovative solutions in order to enable its ramp up. The most important performance aspect of the fine line plating in this market space is plating uniformity or planarity. Plating uniformity, trace/via top planarity, which measures how flat the top of the traces and vias are a few major features. This is especially important in multilayer processing, as nonuniformity on a lower layer can be transferred to successive layers, disrupting the device design with catastrophic consequences such as short circuits. Additionally, a non-planar surface could also result in signal transmission loss by distortion of the connecting points, like vias and traces. Therefore, plating solutions that provide a uniform, planar profile without any special post treatment are quite desirable.
Industry News | 2020-10-04 15:41:30.0
MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and presenting two technical papers at the IMPACT-EMAP Conference, co-located with TPCA in Taipei, October 21-23, 2020. The papers detail some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization.
Industry News | 2009-12-07 18:05:13.0
Breda, Holland - Cobar BV, a member of the Balver Zinn Group, announces the launch of a whole new range of VOC-free and Low-VOC fluxes at Productronica. Being showcased in Stand 570 in Hall A4, these RoHS compliant fluxes fulfil the need for more environmental-friendly materials, maintaining excellent soldering performance. The event is scheduled to take place 10th – 13th November at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
