Electronics Forum: via and fillet (Page 2 of 15)

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar

ICT Question, Via holes and Probes

Electronics Forum | Fri Apr 27 10:55:54 EDT 2007 | Brett

Pete, is there a probe-style that will accomodate a via that's filled, but a little concave (inward) fillet? The ICT personnel complains about this scenario too. I'm not an ICT person, but I do know that there are pogo pins that have a crown (for t

ICT Question, Via holes and Probes

Electronics Forum | Fri Apr 27 08:44:08 EDT 2007 | Brett

For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder? The ICT preson here insists that

Re: Siemens HS50 and F5 and S25

Electronics Forum | Tue Nov 28 16:28:14 EST 2000 | CAL

Chris- The machines you identified are stable products and have been around for over two years now and most bugs have been worked out. The F5 IC head has not changed much since its introduction over 5 years ago. Remember these machine like to run, r

BGA lands and ICT

Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp

Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W

RoHS and stencils

Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane

i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red

AOI, Quality and SPC

Electronics Forum | Tue Mar 04 15:34:31 EST 2003 | ROHAN SARKER

Well very interesting...i think a possible solution can be data acquisition via Matlab and then carrying the necessary operations.Can u give details of your works-----I can then get closer to a possible solution.

Flux Designations and Composition

Electronics Forum | Thu Jul 08 13:30:02 EDT 2004 | Daan Terstegge

I would be glad to host your paper on http://www.smtinfo.net. You can email me via the link on my site. Daan Terstegge http://www.smtinfo.net

Mydata Pick and place

Electronics Forum | Fri Aug 24 08:53:54 EDT 2001 | gerits

Hi, Have a look at following site assembleon.com They have exactly the equipment you're looking for and with the requirements you asking for. In case you want detailed information you can contact me via e-mail or phone (+31 - 40 - 27 66053). I can

Pick and Place Rivet

Electronics Forum | Tue Aug 12 14:49:26 EDT 2008 | awegener

I'm attempting to pick and place a small rivet onto our PCB. The rivet should be attached via reflow solder. The rivet will be used to create a sandwich, holding together a frame and additional circuit board in a package. This part is intended onl


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