New Equipment | Component Counters / SMD Counters
Amikon Limited Quick Turn-Around Time Timescales within the industry are key, and your account manager will always give you an accurate lead-time for every enquiry. amikon prides ourselves on delivering goods when promised, and we can w
Industry News | 2013-11-14 18:21:25.0
Indium Corporation's Sze Pei Lim, Technical Manager - Asia-Pacific Operations, and Sehar Samiappan, Area Technical Manager, will present at the IPC Conference on Assembly and Reliability November 20 in Bangkok, Thailand.
Industry News | 2009-04-21 13:50:36.0
FREMONT, CA � April 2009 � Alta Manufacturing, a leading contract manufacturer specializing in NPI to pilot production of complex PCBs, announces that it has formed a strategic alliance with Alta Via Technologies in an exclusive agreement to develop and implement an innovative technology roadmap that advances the state-of-the-art in the Layout, Fabrication, and Assembly of complex printed circuit boards.
Industry News | 2010-05-14 07:53:24.0
Sensor manufacturer VEGA implements SIPLACE Facts
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
Industry News | 2021-02-25 13:41:10.0
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.
Technical Library | 2017-12-21 11:24:05.0
The present work concerns on the use of sensors to monitor the structural health of wind turbine . Conventionally the inspection was made using non-contact sensing during the turbine’s inoperable period hence loss occurred. A real -time monitoring system via embedded wireless sensor is preferred but the sensor could only be implanted using non-contact printing method due to most turbine blade s’ curved surface. Conductive ink associate d with non-contact printing method via fluid dispensing system are proposed since conductive inks are proven stretchable and fluid dispensing system enables printing on various substrates and works well with any materials...
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
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Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
New Equipment | Assembly Services
China Double Sided Circuit Boards Fabricaiton and Assembly PCBA Turnkey Manufacturer 2 Layers circuit boards PCB FR4 1.6mm PCB fabrication and assembly 1oz PCB copper thickness Shenzhen PCB and PCBA manufacturer China turnkey contract electroni
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
