Electronics Forum | Fri Aug 22 09:44:45 EDT 2003 | davef
Kenny: Since you need to use water soluable flux and can't use no-clean, consider asking your board fabricator to plug the via.
Electronics Forum | Thu Aug 25 10:17:48 EDT 2005 | davef
Send the pic to dave5252 at hotmail.com [you can't send pic through the SMTnet email thing] For more on via plugging, tenting, capping ... look here: http://www.merix.com/technology.php?section=processes&page=pdf/Via_Fill_Plug.pdf Something, a voi
Electronics Forum | Thu Feb 07 11:59:48 EST 2002 | Ron Costa
When double sided BGA's are used on an .062 FR4 10 layer board should via's be plugged and tented? The CACHE chips being used are PBGA's 1.27mm pitch. The pad size is .030 and the finished via dia. is .010. This is a dogbone type pad and via design.
Electronics Forum | Wed Aug 24 08:50:59 EDT 2005 | davef
First, while black pad can be a problem with poorly controlled electroless gold [search SMTnet Archives for background], it is not a suffiecient reason to use electrolytic. It's the reason the supplier should fix their electroless gold process. Se
Electronics Forum | Mon Nov 05 06:27:23 EST 2007 | grantp
Hi, We are also interested in this, and I have heard you can get the PCB's with the via's plugged. Also, if the via's are small, the solder should not penetrate? Anyone have any further info? Grant
Electronics Forum | Wed Jan 05 12:48:44 EST 2000 | Dave F
Millerin: You are generally correct about plugging and over plating vias, but in Michaels case, the via is blind. Plugging would trap air between the bottom of the via and the plug material, causing an air pocket. When heated to soldering temperat
Electronics Forum | Tue Mar 05 22:34:27 EST 2002 | YoYo
You better be careful how you plug vias at screenprint - we currently have a customer that wants vias plugged, so we had a 2% aperature reduction so we would not have to much paste, I believe it should have been reduced more because some of the solde
Electronics Forum | Mon Jul 26 12:55:34 EDT 1999 | M.L
Presently protos of micro-bgas (80i/o) pitch .030/.031 12BGA per assembly The board is a (.062, 4 layers) FR-4 using Dry film Pads .014inch Vias within footprint .020inch Vias to be filled by bottom side(solder side) only .030in dia. Force via plugg
Electronics Forum | Tue Jun 15 22:31:06 EDT 2010 | Mag10
Depending on the how you plug the via, the void level can significantly affected. If you have via plugged from the bottom side; i.e. opposite side of the component, you will see alot of void due to entrapped air in the via hole. I found work best wh
Electronics Forum | Thu Feb 15 12:32:14 EST 2007 | Eric D
one of my customer areworried about the flux risidue in the blind vias, or if the plug the vias and there is air trapped the plug will blow during our process. Appreciate for your response
