Electronics Forum | Tue Jul 03 16:58:27 EDT 2001 | bzark
Any opinion/spec/study on acceptability based on size and location of void in chip cap/res (e.g 0402) solder joints?
Electronics Forum | Fri Apr 24 06:16:50 EDT 2009 | naguiar
CHANGE SOLDER PASTE, AND ADJUST PROFILES. Nolasco
Electronics Forum | Mon Jan 13 17:50:54 EST 2003 | jonfox
I was looking for some good documentation that could nail down some pros/cons of voids, but haven't found any. The biggest issue is if you are going to temp cycle the chips/PCB after assembly. Depending on the cycle, the situation of the test, it c
Electronics Forum | Thu Jan 16 04:02:18 EST 2003 | johnw
The IPC 610 actally conflict's with 7095 which give's a better indication of what's acceptable. I believe that IPC are reviewing both. Motorola did a bunch of work before basically showing that void's aren't that bad up to a certain size, I think pro
Electronics Forum | Mon Apr 27 19:31:12 EDT 2009 | stevek
Remember that the 25% is a reduction in cross sectional area. A void in the middle of the ball that reduces the cross sectional area by 25% is about half the diameter of the ball. If it is closer to either termination, the corresponding size would
Electronics Forum | Wed Jan 15 23:32:36 EST 2003 | tinson
How about section 12.2.12 of IPC-A-610C? It doesn't include detailed description of root cause/effect but acceptance criteria.
Electronics Forum | Mon Jan 17 18:36:26 EST 2000 | William
Voids can be acceptable @ 24% per 5 balls area, and 8% per single ball area. In fact, Proceeding Book 1996; Vol. I, Page #126 conclusions saids: that solder joint voiding at the maximun levels pbserved in this study (were voided area was up to 24 per
Electronics Forum | Mon Jan 17 21:01:21 EST 2000 | Dave F
Dennis: On your BGAs: * Never seen voids any place other than the top ... lower density stuff rises. * Our spec on voids says: 1 Voids 1a Voids in soldered balls shall be less than 20% of the diameter of the solder ball. 1b No void shall sho
Electronics Forum | Tue Feb 19 22:50:00 EST 2008 | amarpreet41
Do you of reducing hole size of DIMM connector will improve solder voids??
Electronics Forum | Wed Feb 09 06:35:18 EST 2000 | Mark Williams
Hi We use 2 criteria... maximum void size is 10% of the solderable surface and a maximum area of voids of 10% of the maximum cross-sectional area of the ball. Any views Mark
