Electronics Forum | Thu May 23 13:00:51 EDT 2002 | cyber_wolf
One more thing I want to add. Don't turn this into some big deal. Its not atom splitting, or black majic.Bottom line is that you are going to be doing some experiments to prove it to yourself and whomever else requires the data. Profiling is time con
Electronics Forum | Mon May 27 11:57:37 EDT 2002 | arcandspark
One thing you should do is characterize your reflow oven, run profile boards of various densities, say 2 gm/sq.in. to 10 gm/sq.in. Adjust the oven settings for these various boards to acheive your standard profile based on your solder paste manufactu
Electronics Forum | Fri May 31 17:52:49 EDT 2002 | fastek
I'm seeing a definate pick up of activity levels in my business. Equipment is finally selling albeit at depressed prices. Unlike last year however when things were not selling AT ANY price. At least there are buyers now. The huge CM's will take a l
Electronics Forum | Tue May 28 13:14:31 EDT 2002 | zanolli
Hello Mark, I'll assume that you are currently wave soldering and would like to eliminate that operation by using pre-forms or press-fit connectors. Solder preforms or solder flux bearing connector leads usually do not require any hole size changes,
Electronics Forum | Wed May 29 08:43:12 EDT 2002 | zanolli
Various solder metal supplies sell pre-forms as loose individual shapes, usually donuts. The loose performs then are placed on the connector leads. If you have any volume at all, you would want to look at a �shake table� that would vibrate a batch of
Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
Electronics Forum | Tue Jun 04 12:54:00 EDT 2002 | Bob
Hi, We are manufacturing a small PCB with large areas of gold plating. We experience from time to time what appear to be solder splashes on the gold areas. I do not believe the contamination to be from "outgassing" due to the distance from the dep
Electronics Forum | Wed Jun 19 00:07:10 EDT 2002 | kenbliss
arzucom, have you considered using trays to handle your boards in process and your handbuilds. This method is fast becoming the industry standard method for a large variety of reasons, specifically ESD as when the boards are in the tray your people
Electronics Forum | Wed Jun 19 00:07:31 EDT 2002 | kenbliss
arzucom, have you considered using trays to handle your boards in process and your handbuilds. This method is fast becoming the industry standard method for a large variety of reasons, specifically ESD as when the boards are in the tray your people
Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick
Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a
