Electronics Forum | Mon Oct 11 06:00:27 EDT 1999 | Brian
| Folk's, | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | I was wanting to do a straw poll on you guy's as to the type of resist's you are us
Electronics Forum | Sun Oct 10 17:57:48 EDT 1999 | JohnW
Folk's, I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. I was wanting to do a straw poll on you guy's as to the type of resist's you are using Glos
Electronics Forum | Mon Oct 11 13:08:29 EDT 1999 | Dave F
| Folk's, | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | I was wanting to do a straw poll on you guy's as to the type of resist's you are us
Electronics Forum | Wed Oct 04 16:18:06 EDT 2006 | cw
My Peak ~ 228-230C (customer wants to see this temperature). solder ball size - 20mil diameter Please advise ASAP. Thanks a lot!!!
Electronics Forum | Wed Oct 04 13:58:38 EDT 2006 | cw
hi Dave.F and All, I need to reflow SCA solder balls on Sn/Pb paste, i get a pretty OK solder wetting and collapse apperance, however, i am seeing voids everywhere, some of them is greater than 25-30%, which has exceeded IPC standard. Please advise.
Electronics Forum | Thu Nov 08 10:52:22 EST 2012 | Bryan Ng
I am considering using high-temp ball Sn10Pb90 + eutectic solder paste for MLC reflow (no underfill). You can see that there is no Intermetallic bond for the paste and the balls. Under high stress/shock condition, the solder joints develop micro c
Electronics Forum | Wed Oct 04 16:21:59 EDT 2006 | cw
Any recommendation?
Electronics Forum | Wed Oct 04 16:45:04 EDT 2006 | cw
Thanks Russ!!! So, you have NO VIODS at all?
Electronics Forum | Thu Oct 05 16:13:35 EDT 2006 | cw
Thanks All!!
Electronics Forum | Thu Oct 26 12:25:46 EDT 2006 | cw
Thanks!!!
