Electronics Forum | Tue May 03 10:32:58 EDT 2005 | davef
DenM: What is the connection between the your contact that disposes of solder and F1358's [the original poster] need to dispose of expired flux powder?
Electronics Forum | Mon May 09 15:56:25 EDT 2005 | dougm
We are a high mix/low volume shop (avg. lot size is about 60). Hand solder was a bottleneck, so we looked into selective machines. We purchased a Vitronics-Soltec mySelective and are very happy with it so far. Although it has a large footprint, ev
Electronics Forum | Wed May 04 12:14:18 EDT 2005 | rlackey
Hi Hoss, I was speculating - there are others out there with more experience in this field than me, who may know the definitive on this. I've heard rumours on transformers but nothing concrete. But I was guessing that the transformer (as a whole)
Electronics Forum | Mon May 09 01:30:40 EDT 2005 | Hannu
Hi Pat, And thanks for the sympathy :) This thing with ultrasonic transducer, is it something tried and trusted or is this a new idea for improving the wetting behaviour of leadfree alloys? This is completely new to me, can you please elaborate on
Electronics Forum | Thu May 05 11:50:03 EDT 2005 | russ
Just went through this with a customer. Removed BGAs and noticed discolered pads at some locations. It was determined that these were open connections that had some type of flux migration between the ball. They also took solder readily. This may
Electronics Forum | Thu May 05 12:00:16 EDT 2005 | russ
Bad cleaning practice is suspect. It is believed that W.S. flux was used to solder adjacent components and then hand cleaned. This is not definite but it is pretty certain.
Electronics Forum | Thu May 05 15:25:38 EDT 2005 | jimmiem
Would a lesser degree of black pad still allow solderability as i seen in my case?
Electronics Forum | Thu May 05 16:02:43 EDT 2005 | russ
I don't believe that you are seeing black pad. I think you are seeing an oxidized pad from your statement that these pads take solder. I would guess that these will be fine. But I would re-tin all pads prior to attaching the BGA to make sure.
Electronics Forum | Thu May 05 11:50:46 EDT 2005 | twitcht
Currently, our AOI is performed after all solder processes. I think we would be better served incorporating AOI before reflow. Does anyone have supporting data like ppm or ROI?
Electronics Forum | Mon May 09 08:31:23 EDT 2005 | jdengler
Grayman, You might want to read this paper. http://www.speedlinetech.com/docs/Equipment-Lead-Free-Wavesoldering.pdf Jerry
