Electronics Forum | Wed Nov 21 04:46:27 EST 2001 | emmanuel
Yes, i confirm you that the BGA i'm refering to are Motorola BGA. The fractures that appear after 500 thermal cycles (-45�C/+125�C) are located in the solder joint/pad connection. We have been asked if this fractures are due to BGA & PCB design or to
Electronics Forum | Mon Nov 26 14:48:43 EST 2001 | PeteC
The tooling fixture has tooling pins to accomidate your PCBs. Typical PCB tooling holes are 0.125" dia. non-plated thru holes and 0.250"x0.250" from the edge of the PCB. Check out this link to EMC Global Technologies. They mfg. tooling fixtures for U
Electronics Forum | Fri Feb 15 02:49:35 EST 2002 | nifhail
What are the consequences of having the Moisture sensitive component to be overbaked. Say if the specs. calls for 125 C +/- 5 C for 48 hours, but they components were accidently left in the oven during a weekend, wih the oven still operating, to make
Electronics Forum | Thu Apr 11 14:20:29 EDT 2002 | sleech
We have just introduced a new drying process that operates at only 55 deg. C and has proven to be able to drive moisture from tape and reeled devices or compontents in shipping tubes as effectively or more effectively as a convection oven at 125 deg
Electronics Forum | Mon May 27 18:25:03 EDT 2002 | Carol Stirling
Thanks for the information Reworkman, We are leaning to the theory of better safe than sorry. I think I'd supply the bags and dessicant just to eliminate manufacturing issues. What temps & times do you ask your boardhouse to bake to? Ours said some
Electronics Forum | Sat Feb 01 16:11:24 EST 2003 | Paul Smith
I would suggest scoring if the profile allows, leaving residual material of circa 40 - 50 mil - That is what I do on a 125mil thick PCB width of the pis is approx 200 mil Mouse bites on a board as thick as 135 mil will mean its extremly difficult to
Electronics Forum | Thu Feb 27 03:26:13 EST 2003 | damianlai
Hi, I would appreciate some advice / recomendations regarding conditioning of PCB's before use. Our standard PCB's are double sided and rigid multilayer FR4. We are currently baking everything over 3 months old for 2 hours at 125 degrees C. Is thi
Electronics Forum | Sun Mar 21 21:27:26 EST 2004 | laxman
We are also facing this issue. Normally we are baking all MSD 24 HRS @125�C. This may not be a standard practice. I have read that depending on the Package thickness Baking time and temperature varies apart from the storage conditions of the IC. IS t
Electronics Forum | Sat Jan 08 08:50:35 EST 2005 | davef
Normally, you should not have to bake boards that are properly packaged and stored. Since you are seeing problems, baking makes sense. Consider 125C for 4 to 6 hours. Additionally, look here for more, while waiting for others: http://www.smtnet.
Electronics Forum | Tue Jan 18 12:41:14 EST 2005 | paulom
I am having some problems with regard to soldering of PBGAs. In the factory had high humidity. Can I make Bake in different temperatures of 125 and 40 degrees? Which the minimum temperature? How many times I can effect bake without damaging the com
