Electronics Forum | Wed Apr 30 21:18:55 EDT 2003 | davef
Morris Why do want to do this [keep solder from pads]?
Electronics Forum | Thu May 01 15:08:52 EDT 2003 | k_h
If Kapton tape doesn't work, I would recommend eating a few hundred bucks and ordering a new stencil. I think your asking for more trouble trying to plug the apertures with dried paste, glue, or anything else. It will dislodge sooner or later and pro
Electronics Forum | Fri Dec 17 15:26:48 EST 1999 | Victor Salazar
We use a homeplate design with 80% coverage on the tab, and 100% coverage on the leads 6mil stencil. All of our stencils are laser cut electropolished. We have had good success with this.
Electronics Forum | Tue Feb 12 14:00:53 EST 2013 | dyoungquist
We have a board with a 1.0mm pitch BGA. The stencil apertures are 0.0177 inch diameter. We used an electroform stencil with good results.
Electronics Forum | Fri Dec 10 10:25:59 EST 1999 | Wolfgang Busko
Hi Larry, you might find something looking for the thread "D-Pak misalignment Problem - Kantesh Doss 23:43:23 12/02/1999" Good luck Wolfgang
Electronics Forum | Mon Feb 18 12:09:17 EST 2013 | pbarton
What type of flux material does your solder paste have? I have seen difficulties when attempting to print small apertures with water washable and rosin types. Do you get a good first print and then have problems or is it the same from the start?
Electronics Forum | Tue Dec 23 17:34:07 EST 2008 | davef
We hear you talking two main issues: 1 Solder paste release 2 Thoughts on using two passes of solder paste on the stencil 1 Solder paste release * Check your aperture & aspect ratios [Search the fine SMTnet Archives for more] * Do a better job with
Electronics Forum | Thu May 01 09:02:55 EDT 2003 | ehess
we have used board mask that we let dry. It's tricky to get it flat with no spikes, but after a few tries you'll get it. I like the guys recommendation to try paste and let it dry. we have that problem when the operators do not clean the stencil p
Electronics Forum | Fri Jan 15 08:43:43 EST 1999 | Mike McM
Bernie, If the pads are for a chip component and only about a half a pad off without anything else in the misregistered area, go ahead and use the stencil as is. Surface tension of the solder at liquidus should cause it to wick back to the pad, even
Electronics Forum | Fri Jan 15 09:11:28 EST 1999 | Steve Gregory
| Due to an foul up on my part, a circuit board ECO snuck up on me and I have a solder paste stencil that doesn't quite match the board. Two pads are off by about half a pad each. | | Can the solder paste stencil be modified? If so, what is the tec
