Electronics Forum | Mon Jan 10 22:43:43 EST 2005 | davef
First, we know nothing about your assemblies or how storing them in an "unconditioned" warehouse will affect their performance or post-storage processing. Second, there are no specifications, because what might be good in one application might not b
Electronics Forum | Fri Feb 25 16:34:53 EST 2005 | jimmyb
In your PDs you must specify a single nozzle size. Meaning don't assume that entering nozzle size max=1.3 and nozzle size min=1.3 forces the machine to use a 1.3. Nozzle size min is not used in the CP6 software (it only uses nozzle size max), there
Electronics Forum | Sat May 14 17:25:20 EDT 2005 | fastek
"What can be done to create economical advantages over here is review the product flow and eliminate process steps with current existing technology. Process steps that can safely be eliminated are cleaning, visual inspection, post wave assembly etc.
Electronics Forum | Thu Jun 09 05:04:05 EDT 2005 | Joseph
Dear Patrick, Unfortunately we do not know what exactly the failure as our customer refuse to reveal to us. From visual inspection the solder joints are smooth and shiny as per IPC-A-610 requirements. The component supplier (IR) commended that they
Electronics Forum | Tue Aug 23 22:50:09 EDT 2005 | adeline_ko
My process guy told me that. Due to black spot issue, brd with BGA must use electrolytic finishing. And when we had this finishing with plug via, the blister issue pop out. My supplier claim that this is due to the plug via. Which I don't know how
Electronics Forum | Thu Oct 06 18:58:29 EDT 2005 | PWH
Holders and blades can be spendy. "JNJ" is good place to get aftermarket stuff (I have no affiliation with them). I've also found laser cut metal blades work fairly good and are cheap. Your stencil supplier might be able to cut them for you if you
Electronics Forum | Wed Apr 25 15:19:15 EDT 2007 | flipit
Steve, See the link below. See the out take from the link below. http://forum.europa.eu.int/Public/irc/env/rohs/library?l=/requests_exemptions/resistant_applications/hpdoc/_EN_1.0_&a=d The specific verbiage is, "This exemption request seeks to
Electronics Forum | Fri Feb 15 15:55:58 EST 2008 | pjc
This is from the OmniFlo 5 Engineering data sheet: EXHAUST SPECIFICATIONS: STANDARD AIR OPERATION: - Load-end: 150 cfm (255 m3/hr) at the 4� (102 mm) stack (minimum requirement) - Unload-end: 300 cfm (510 m3/hr) at the 4� (102 mm) stack (minimum req
Electronics Forum | Thu Aug 14 18:04:36 EDT 2008 | smt_guy
I have made couple of investigations with our oven. I set-up 5 product profiles and run a thermal profile measurement and record them. Then I set-up one more product profile and rename that as Validation Profile then measured the thermal profile. A
Electronics Forum | Mon Dec 15 15:34:17 EST 2008 | dyoungquist
Sorry it has taken me so long to respond. I got pulled off onto other projects and was not able to work on the solution to the problen until recently. The solution we have come up with is to change from no-clean flux based solder paste to water sol
.gif)
