Industry News | 2011-03-17 17:48:27.0
The OK International team will display and demonstrate its full range of soldering and production assembly technologies at this year’s IPC/APEX Expo in Las Vegas, April 12-14. These industry-leading solutions will be fully operational at booth # 1634, including advanced soldering, desoldering and rework systems, programmable pre-heaters, fume extraction and a comprehensive range of dispensing technologies.
Industry News | 2015-05-24 10:37:43.0
Having produced the first book, video and interactive CD-ROM on pin in hole intrusive reflow we believe we are in a good position to help engineers achieve better yields and implement high and low temperature processes with our next PIHR webinar http://www.bobwillisonline.com/training_detail.asp?WorkshopID=129
Industry News | 2019-05-27 21:16:27.0
SHENMAO America, Inc. introduces PW215 Water Soluble Solder Paste, ideal for SMT and IC packaging applications. With a wide reflow window, this water soluble solder paste can effectively fit into the design process for even the most complex SMT or IC assembly substrate designs.
Industry News | 2016-04-07 09:09:16.0
Finetech/Martin will showcase three new dispense products and a new version of the Mini-Oven BGA/CSP reballing unit in Booth #1259 at the upcoming IPC APEX Conference scheduled for March 15-17, 2016 at the Las Vegas Convention Center.
Industry News | 2012-04-19 09:00:53.0
MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Toronto Expo & Tech Forum,
Industry News | 2012-05-31 21:36:12.0
MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Upper Midwest Expo & Tech Forum
Industry News | 2016-02-17 16:31:00.0
Akrometrix LLC will exhibit in Booth #1623 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
Industry News | 2016-02-18 19:59:51.0
Akrometrix will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. PAC Global also will demonstrate the new Akrometrix Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
Industry News | 2008-12-03 16:12:20.0
The RO06-PLUS batch oven from Essemtec offers lead-free soldering capability as well as curing programs with durations up to 18 hours. The oven features a small footprint, integrated microprocessor control and fully automatic processing. Its main applications include prototyping, small batch manufacturing and testing.
Industry News | 2021-12-21 15:06:19.0
KIC will exhibit in booth 3009 and the Factory of the Future Pavilion at the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022, at the San Diego Convention Center San Diego, CA. The KIC team are thermal process experts who make ovens smarter. Along with award-winning Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking and their complete ecosystem of solutions for thermal processes.
