Industry News | 2016-10-26 14:55:50.0
Vass, NC – Sept 20, 2016 – PACE Worldwide announces an introductory promotion in conjunction with the launch of their new TF 1800 BGA/SMD Rework System, which began shipping in October. For a limited time, PACE will provide 10 Heat Focusing Nozzles free of charge with the purchase of each TF 1800 System, a value of over $3,400 (£2,700/€3,340).
Industry News | 2018-07-02 21:54:56.0
SHENMAO America, Inc. is pleased to introduce the PF606-P245 New Generation Lead-free Zero Halogen Solder Paste. The paste provides continuous high-speed printability that produces superior solder paste print quality as well as a wide reflow process window for excellent solderability.
Industry News | 2019-01-22 13:06:44.0
At IPC Apex 2019, PACE Worldwide will showcase their new TF Series of BGA Rework Systems. The TF1800 is designed for standard board sizes of up to 12” x 12”, while the TF2800 is for extra large, high mass PCB’s up to 24” x 24”. The TF1800 will be on display at our booth (#2809) and will be available for live demonstrations.
Industry News | 2018-12-08 03:15:55.0
SMT Book – Surface Mount Technology Book PDF
Industry News | 2018-12-08 03:17:14.0
SMT Book – Surface Mount Technology Book PDF
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2021-02-12 16:18:20.0
Kurtz Ersa Inc. today announced plans to participate in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Ersa has upgraded its demo/application centers to interactive virtual showrooms where the team will give customers in depth and personalized equipment demonstrations for wave soldering, reflow soldering, selective soldering, rework equipment, I4.0 connectivity and more. The company will highlight the EXOS 10/26, Ersa VERSAEYE and and HR 600 XL during the virtual event.
Industry News | 2023-09-14 17:50:57.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
Industry News | 2020-05-30 12:34:54.0
SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.
