Electronics Forum | Fri Dec 02 01:49:48 EST 2016 | jeya7376
I want to do improvement in conversion time. We running small quantity board and frequently do conversion. we produce very simple board no BGA only resistor, capacitor, LED, IC and transistor. We are running same model top and bottom in 1 reflow oven
Electronics Forum | Fri Jul 23 01:32:21 EDT 1999 | KYUNG SAM PARK
HI Earl Thank you for your answer. Let me know you about the hot you mentioned First of all, The rework machine is the BGA3500 (manufactured by 0.k international:U.S.A) ��DESOLDERING HEAT :OVER 200��(CENTIGRADE),30SEC(CHECKED BY
Electronics Forum | Tue Jul 07 03:34:06 EDT 1998 | Martin Kelly
Hi just to let you know, in case you don't, but an x-ray machine is needed too check the solder balls, once they've been placed. See you later, | | I am very interesting of getting information about the criteria inspection of BGA. Example, what are
Electronics Forum | Tue May 02 23:34:26 EDT 2006 | Frank
The 2060RE model that I have can do an 18"x20" board. I think the Mydata can do larger. Juki did tell me that next year they will release a machine that will do larger boards but didn't specify on how big. The 2060RE can do 0201 up to 74mm square
Electronics Forum | Tue Aug 22 03:04:07 EDT 2006 | PP
Any help/suggestion is much appreciated I am doing lots of BGA Reworks from a small uBGA with a few balls to a large BGA with over 1500 balls. The reworks have been done on SRT 1100 Series Machine for many years. SRT 1100 Machine is good for the c
Electronics Forum | Wed Aug 24 08:43:45 EDT 2005 | PWH
What kind of problems/defects/process indicators are you having? It is likely that you will have to bite the bullet and get a thermal profiling mole to prove that your selected profiles are subjecting parts to the correct tempertures per part specs.
Electronics Forum | Tue May 21 15:36:22 EDT 2019 | gregoireg
Thanks to @davef and @Evtimov for trying to help. It's useful but not exactly the answers I would like to get. I'm going to reformulate my question. I'm writing in mm so that it's more precise: I have a 0.12mm-thick stencil for some 0.4mm-pitch QFN
Electronics Forum | Mon Apr 24 17:42:34 EDT 2000 | Dave F
Rich: Awww, don�t worry that you have to ship product. This moisture sensitive part thing is more important. ;-) And don�t worry that everyone is giving you guff and no one is supporting you. Yours is a thankless job. ;-) You got it right!!!
Electronics Forum | Wed Feb 22 10:00:58 EST 2006 | dougs
We've just set up a couple of products with 0.5mm pitch uBGA devices on them, i went for 5thou thick, laser cut nickel (to aid paste release) square pads same size as the diameter of the uBGA pads. Or you could go to a 4 thou nickel stencil, better
Electronics Forum | Tue Jul 27 11:32:01 EDT 1999 | M.L.
| | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | 12BGA per assembly | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | Pads .014inch | | Vias within footprint .020inch | | Vias to be filled by bottom side(solder side) only
