Industry News | 2017-03-23 11:33:40.0
Outline of PNC Inc's BGA assembly capabilities.
Industry News | 2024-03-18 12:35:19.0
SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO's latest advancements in solder paste technology.
Industry News | 2011-01-11 13:37:34.0
Practical Components has added the Casio Micronics WLP Wafer Chip Size Package (WLP) to its comprehensive line of dummy components. The WLP is a miniature package, suitable for installation in surface mount technology (SMT).
Circuit Technology Center, Inc.
Industry News | 2011-03-21 13:00:44.0
KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces an opportunity to win an Apple iPad2 by beating its award-winning Auto-Prediction Navigator Profiling Software. All participants will receive a certificate for a free upgrade to Navigator Power, a $975 value*!
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2017-03-14 10:44:55.0
Developed by XJTAG®, the free software for PADS® Schematic Design will significantly increase the Design for Test and Debug capabilities of the schematic capture and PCB design environment.
Industry News | 2008-03-20 16:08:23.0
LITTLETON, MASS. - VJ Electronix, the leader in X-Ray inspection technology and Rework systems, announces that it will exhibit the Summit 1800A advanced rework system in booth 648 at the upcoming IPC APEX exhibition and designers summit, scheduled to take place April 1-3, 2008, in Las Vegas, NV
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2007-10-23 17:27:36.0
Indium Corporation�s *Indium5.1AT Pb-Free Solder Paste *is an Award-Winning No-Clean, Pb-Free Solder Paste that delivers enhanced finished goods reliability by featuring;
