This video is for the PDR IR-C3 Chipmate 2000 Rework system/station - Operational Video. It gives you an overview and shows you the basics of how to operate your PDR IR-C3 Rework system. www.pdr-rework.com
Industry News | 2018-09-18 20:27:42.0
PDR today announced plans to exhibit at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will have the IR-C3 Chipmate Entry-Level SMD/BGA Rework Station and IR-E3 Evolution Series SMD/BGA IR Rework Station in Booth #527.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Since 1992 Contract Manufacturer (Circuit Boards) Service,Reliability,Quality. ISO certified Controlled Goods Certified IPC standards Engineering Certified CID & CID+ National & International customer base Totally Service Oriented
Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol
Automated 2D inspection Unsurpassed image quality Highest defect detection, low false calls Fast throughput Quick set-up Cost effective Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete i
New Equipment | Assembly Services
Our extensive PCB assembly expertise incorporates: Prototypes and pilot builds Conventional electronics assembly Surface mount assembly State-of-the-art equipment RoHS and non-RoHS facilities Cost effective design Core to the JJS Electronics m
Demonstration of BGA rework via stencil printing. BEST's StikNPeel stencil is an adhesive backed stencil which allows users to stick the stencil in to place and simply peel it off the PCB with a temporary adhesive system. This leaves consistent print
Technical Library | 2007-11-29 17:20:31.0
Programs have been developed to predict the expected yield of flip chip assemblies, based on substrate design and the statistics of actual manufactured boards, as well as placement machine accuracy, variations in bump sizes, and possible substrate warpage. These predictions and the trends they reveal can be used to direct changes in design so that defect levels will fall below the acceptable limits. Shapes of joints are calculated analytically, or when this is not possible, numerically by means of a public domain program called Surface Evolver. The method is illustrated with an example involving the substrate for a flip chip BGA.
Career Center | Rochester, New York USA | Engineering
Job Description: Implements and analyzes manufacturing engineering plans and projects. Designs, develops and transfers manufacturing and engineering tools, strategies and systems. Develops manufacturing strategies for specific products and processes
