Electronics Forum | Wed Aug 28 19:35:13 EDT 2002 | ppwlee
Hi, Does anyone have guidelines on minimum SMT component spacing for bottom sided wave soldering? I am looking for general rule of thumb in wave soldering bottom side SOTs, 0805 & 0603s. How about minimum through-hole lead to pad distance? Peter
Electronics Forum | Wed Aug 28 19:36:29 EDT 2002 | ppwlee
Hi, Does anyone have guidelines on minimum SMT component spacing for bottom sided wave soldering? I am looking for general rule of thumb in wave soldering bottom side SOTs, 0805 & 0603s. How about minimum through-hole lead to pad distance? Peter
Electronics Forum | Sat Nov 09 08:04:52 EST 2002 | erhard
if you wave solder you have to glue the SMD parts on the bottom side. If you reflow the bottom side then you usually shouln't go over the wave afterwards. It's quite logical the joints melt again, that's what you want to achieve going over the wave.
Electronics Forum | Sat Dec 05 09:17:24 EST 2009 | nagesh
Solder paste & reflow the Bottom side.Use wave solder pallet to isolate the soldered components.
Electronics Forum | Mon Feb 09 08:34:50 EST 2015 | saoasasd
In my case most of the PCBs are OSP finishing and worst case of MSD component on bottom side is level 3 (168 hours). You mean that PCB shelf life with bottom side assembled shoud be 84 hours?
Electronics Forum | Thu Jul 15 12:02:38 EDT 2004 | Yngwie
We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl
Electronics Forum | Fri Jul 16 03:35:34 EDT 2004 | Yngwie
We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl
Electronics Forum | Tue Dec 21 00:10:00 EST 1999 | Edmund
Currently i am producing a board using dloble reflow process. The bottom side is mostly 0603 chips and some SOIC. The top side is mostly QFP and some heavy component. During the double reflow process , the capacitor chip on the bottom side drop(same
Electronics Forum | Wed Mar 11 09:06:06 EDT 2009 | lococost
No, it's not. Bottom components will reflow regardless of bottom side heaters.
Electronics Forum | Fri May 12 20:15:49 EDT 2000 | M Cox
There are a variety of options without knowing what kind of components are on the bottom side (C's and R's 0805 or 0603 or 0402) you are talking about consider the following Option 1 If bottom side has only Caps, resistors and/or Soic's then... Top s
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