Electronics Forum | Tue Sep 07 06:17:31 EDT 1999 | Earl Moon
| | My company is starting a prototype. The chips that will be used appear to be very sensitive. The vendor part number is Neta-40-2. | | My question is what solder temp should be used for this part? | | Any advice is appreciated. | | THX. | | | |
Electronics Forum | Thu Feb 11 09:59:49 EST 1999 | Dave f
| I would like to have information about the processability of different packages. | In particular I would like to known for which package I can use a double reflow for soldering. | | Best Regards | | | Michele: Double sided reflow is common pra
Electronics Forum | Wed Dec 05 17:30:02 EST 2001 | davef
How do you know that "approx 450�C" is "too high"? As a side, the temperature on the temperature sensor is: * Inaccurate. * Not the temperature at the solder. Listen, operators are smart people. They have figured-out that they can solder faster wi
Electronics Forum | Wed Jul 17 11:26:19 EDT 2013 | pbarton
What equipment do you have? As well as the comments from others, another major influencing factor can be the residual heat in your PCB carrier. It takes more heat energy to warm a cold carrier than if it is already hot from the last cycle run. This
Electronics Forum | Fri Dec 17 13:23:15 EST 1999 | Chris
I have an underfill material which takes 6 hours to cure. It works great, better than any other underfill I have ever used. A vertical cure oven is too expensive. I am currently using batch style ovens and opening the oven door as additional produ
Electronics Forum | Tue Apr 27 16:21:09 EDT 1999 | Chrys Shea
| Another basic soldering question. I notice that lead-free solders have become required for plumbing applications due to legislation. In a local hardware store, I noticed the existence of lead-free solders (based upon tin-copper I think) with a me
Electronics Forum | Tue Aug 31 19:16:59 EDT 1999 | Steve Surtees
| I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average ram
Electronics Forum | Fri Nov 15 15:02:37 EST 2002 | MA/NY DDave
OK I know it is funny to have two different PWB/PCB processes, one for pre production and one post production yet it is possible if controlled and implemented in a strategy. In debug if your company's experience has been for a repeated need to do IC
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Sun Oct 10 18:53:04 EDT 1999 | Dreamsniper
| | | | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | | | | | PCB is FR4 | | | | Solder Mask is LPI | | | | Reflow and W/S Profile =
