Electronics Forum | Tue May 31 22:40:24 EDT 2011 | bejrananda
HI All, Please kindly advice me, I have project that it has DPAK part (MPN:SUD25N15-52 E3 Plating:100% Sn matte)which locate on bottom side (1st reflow), Good wetting for 1st reflow.. but .. when I run Top side (2nd reflow).I found that this D
Electronics Forum | Tue Aug 20 09:26:36 EDT 2013 | proceng1
I believe that Rain-X contains silicone and Nano-ProTek solution does not. I did speak with a field service guy for Nano-Protek and he told me the special coating test pen that they offer is just a sharpie with their logo on it. Thats how I test to
Electronics Forum | Thu Jan 02 22:09:15 EST 2020 | Zack
Hello, Can you give more detail on LGA parts in question? is 50 mm x 50 mm is overall size of the parts? What about pad pitch and how big is the pads individually? I assume that 50x50 mm is overall size. How about the stencil opening for the LGA pad
Electronics Forum | Thu May 05 14:58:29 EDT 2022 | glasscake
BGAs are semi difficult, imagine spending a full shift looking at the same 3 BGA groups and you can see how an operator would get distracted and let marginal results through. I noticed great benefits with micro BGA components. When experimenting wit
Electronics Forum | Tue Mar 08 02:28:03 EST 2011 | nagesh
I have an issue with PLCC Insufficient Heel solder joint fillet.The aperture dimension is : 30 x 100 mils on PCB & on stencil also(1:1 per gerber).Rohs Process. My stencil thickness is 5mils due to presence of Tssop & QFP package & i cannot increase
Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie
We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro
Electronics Forum | Thu Oct 28 09:25:35 EDT 1999 | Dave F
Chris: Typical non-wetting causes are: * Poorly controlled soldering process * Incorrect material * Surface contamination * Insufficient preheat * Misapplied solder mask * Shadowing Without intending to insult you, all of the causes of non-w
Electronics Forum | Wed Apr 07 09:54:32 EDT 2004 | Dreamsniper
Hi Guys, Can anyone help me in providing their experience in process related problems with regards to the above equipment? I noticed that it's slightly different with the wave soldering. Wave Process: Apply Flux, Pre-heat then Solder Selective Sol
Electronics Forum | Thu Jun 02 22:40:13 EDT 2016 | slouis2014
Hi, yes have a few experiments initially i tried to increase the solder volume but component pin have insufficient solder. 1. The solder coverage do you calculate it by solder volume or solder area. 2. if i would achieve as you recommend 50-60 % woul
Electronics Forum | Wed Mar 10 16:48:13 EST 2021 | rsatmech
Below list based on my observations. Nozzle block Sensor block Insufficient issue in printing Solderability issue due to fod
